WMSIC Electronic Components

XUNPU TYPEC-304-BCP16

ModelTYPEC-304-BCP16
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU TYPEC-304-BCP16
Type
XUNPU
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
TYPEC-304-BCP16
Electronic Component
1
Package
SMD
Electronic Component
USB Connector
Electronic Component
0.792g
(L)
7.35mm
Electronic Component
1
Electronic Component
USB 3.1
Electronic Component
BM0265062314
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
1
Electronic Component
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TYPEC-304-BCP16 Type-C连接器产品概述

TYPEC-304-BCP16是讯普(XUNPU)推出的一款全功能Type-C母座连接器,针对小型化、高可靠传输需求设计,兼容USB 3.1协议,采用卧贴SMD封装,广泛适配消费电子、小型外设等场景。以下从核心参数、设计特点、应用价值等维度展开概述。

一、产品核心定位与基础信息

该连接器定位为中低端消费电子级全功能Type-C母座,核心属性清晰,基础参数如下:

  • 连接器类型:Type-C(USB Type-C接口)
  • 协议标准:USB 3.1 Gen1(理论传输速率10Gbps)
  • 接口属性:母座(适配Type-C公头)
  • 安装方式:卧贴(SMD表面贴装)
  • 触点数量:16Pin(Type-C标准全功能引脚,含电源、数据、CC识别等)
  • 端口数量:单端口
  • 电源参数:额定电流3A、额定电压20V(支持USB PD快充)
  • 可靠性参数:插拔寿命1万次、工作温度-25℃~+85℃
  • 结构参数:体长7.35mm、胶芯黑色
  • 品牌与封装:XUNPU讯普、SMD表面贴装

二、关键技术参数的实际价值

参数设计直接对应应用场景,以下解析核心参数的实用意义:

  1. USB 3.1协议:兼顾速度与兼容性
    支持10Gbps传输速率,比USB 2.0快20倍,可满足高清视频(1080P/60fps)、大文件(1GB)快速传输;同时向下兼容USB 2.0/1.1,适配老设备与新设备连接。

  2. 3A/20V电源:适配主流快充
    符合USB PD 3.0协议,支持18W(9V/2A)、20W(20V/1A)等常见快充功率,覆盖手机、TWS充电盒等设备需求(注:5A大电流快充需选更高规格)。

  3. 小型化设计:适配紧凑设备
    体长仅7.35mm,比常规Type-C母座短10%以上,节省PCB空间,适合蓝牙耳机盒、智能手环等小型化产品(此类设备内部空间极窄,过长连接器易导致结构冲突)。

  4. 1万次插拔寿命:满足日常周期
    按每天插拔5次计算,可稳定使用5年以上,符合消费电子常规生命周期;宽温范围(-25℃~+85℃)适应南北温差、户外环境。

三、结构设计与工艺特点

  1. 卧贴SMD封装:提升生产效率
    表面贴装工艺无需插件孔,适合自动化生产线批量生产,降低人工成本;卧贴比立贴节省30%以上高度空间(通常≤5mm),适配超薄设备。

  2. 16Pin全功能:支持多场景传输
    包含2组电源、4组USB 3.1数据、2组CC识别等引脚,可实现:

    • 数据传输(USB 3.1/2.0)
    • 充电(USB PD)
    • 音视频(兼容DisplayPort Alt Mode)
    • 正反插识别(CC引脚实现协议协商)
  3. 黑色胶芯:耐温抗老化
    采用LCP液晶聚合物,黑色设计减少内部反光(适配光学敏感设备),耐温性符合工作范围,长期使用不易变形、老化。

四、典型应用场景

该连接器因小型化、全功能、高性价比,主要应用于:

  1. 消费电子小型设备:TWS充电盒、智能手环、迷你移动电源(10000mAh以下);
  2. 迷你外设:USB-C迷你集线器(1-2口)、无线充电器(Type-C输入);
  3. 车载小配件:迷你车载充电器、蓝牙接收器;
  4. 工业便携设备:小型温湿度传感器、便携检测仪器(低功耗款)。

五、选型与使用注意事项

  1. 选型要点:

    • 需全功能Type-C选16Pin,仅充电/USB 2.0可选低Pin数;
    • 5A大电流快充需换支持5A的连接器;
    • PCB需预留≥8mm长度空间(含焊接间隙)。
  2. 使用注意事项:

    • 焊接温度≤260℃(峰值),避免损坏胶芯;
    • 避免连接器受过大拉力,防止引脚断裂;
    • 焊接后清理助焊剂残留,防止引脚腐蚀。

总结

TYPEC-304-BCP16是讯普针对小型化全功能Type-C需求推出的高性价比产品,平衡了传输性能、电源能力与可靠性,适配多场景消费电子与小型外设,适合批量生产应用。其小型化设计、全功能16Pin及USB 3.1协议,可满足当前主流小型设备的传输与充电需求。

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