WMSIC Electronic Components

XUNPU FPC-05F-10PH20

ModelFPC-05F-10PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05F-10PH20
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05F-10PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.365g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0266114409
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
10P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05F-10PH20翻盖式下接FPC/FFC连接器产品概述

一、产品定位与核心用途

FPC-05F-10PH20是讯普(XUNPU)品牌推出的小间距卧贴式FPC/FFC连接器,专为轻薄便携设备、小型数码产品及微型工业模块的柔性电路连接设计。其核心解决高密度布局下的稳定信号/低功率传输需求,适配0.3mm厚度的FFC/FPC电缆,可快速实现柔性电路与PCB的可靠连接,无需额外工具即可完成插拔,提升生产效率。

二、核心结构特性

1. 锁定与操作设计

采用翻盖式锁定结构:使用时只需向上翻开翻盖,将FPC/FFC电缆插入指定位置,再向下按压翻盖即可锁定——该设计无需螺丝或卡扣辅助,插拔操作简便,且翻盖闭合后能紧密固定电缆,避免振动或外力导致的松动脱落,提升连接可靠性。

2. 触点与安装方式

  • 下接触点:触点位于连接器底部,与FPC/FFC电缆的导电面垂直对接,适配柔性电缆的常规布线方向;
  • 卧贴SMD封装:表面贴装式安装,无需PCB钻孔,直接焊接于PCB表面,节省垂直空间;
  • 0.5mm间距+10P触点:小间距设计支持高密度电路布局,10个独立触点可同时传输多路信号(如数据、控制、电源),满足多通道需求。

3. 尺寸与材料规格

  • 板上高度仅2mm:超薄设计适配超薄设备(如智能手表、蓝牙耳机)的内部空间限制;
  • 接入电缆厚度0.3mm:兼容市场主流0.3mm厚度的FFC/FPC柔性电缆,无需定制特殊线缆;
  • 触头材质与镀层:触头采用磷青铜(弹性好、耐磨损,长期插拔不易变形),表面镀锡(抗氧化、接触电阻稳定,避免信号衰减)。

三、关键性能参数

1. 电气性能

  • 额定电压:50V DC/AC(符合低压信号传输的安全标准,可满足一般控制信号、小功率电源需求);
  • 额定电流:500mA/触点(单触点承载能力足够覆盖多数消费电子的信号传输,10P总电流可满足多通道同时工作);
  • 接触电阻:典型值≤20mΩ(锡镀层保证接触紧密,信号传输损耗低);
  • 绝缘电阻:≥100MΩ(触头间绝缘性好,避免串扰)。

2. 环境与机械性能

  • 工作温度:-25℃~+85℃(覆盖冬季低温、夏季高温及常规工业环境,无需额外散热);
  • 插拔寿命:≥30次(满足批量生产中的反复测试需求,长期使用可靠性稳定);
  • 振动耐受:可承受10~2000Hz的振动测试(符合便携设备的日常振动场景)。

四、典型应用场景

FPC-05F-10PH20的小间距、低高度及可靠性能,使其适配以下场景:

  1. 便携电子设备:智能手机(屏幕与主板连接)、智能手表(传感器模块与主板连接)、蓝牙耳机(电池与主板连接);
  2. 小型数码产品:数码相机(镜头模块与主板连接)、便携式打印机(打印头与控制板连接);
  3. 智能家居设备:智能门锁(指纹模块与主板连接)、智能音箱(麦克风阵列与控制板连接);
  4. 微型工业模块:小型传感器(如温湿度传感器)、微型控制器(如单片机扩展板)。

五、品牌与品质优势

讯普(XUNPU)作为专注连接器领域的品牌,FPC-05F-10PH20具备以下优势:

  • 材料把控:磷青铜触头与锡镀层均采用行业优质原料,镀层均匀无气泡,接触可靠性稳定;
  • 工艺成熟:SMD卧贴封装精度达±0.1mm,适配自动化贴装生产线,降低生产不良率;
  • 环保合规:符合RoHS、REACH等环保标准,无有害物质残留,适配出口产品需求;
  • 售后支持:提供样品测试、技术咨询及批量定制服务,满足不同客户的应用需求。

综上,FPC-05F-10PH20凭借小间距、低高度、操作简便及稳定可靠的性能,成为轻薄便携设备及微型模块柔性连接的优选方案。

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