WMSIC Electronic Components

XUNPU FPC-05F-32PH20

ModelFPC-05F-32PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05F-32PH20
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05F-32PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.584g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265583430
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
32P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05F-32PH20翻盖式下接FPC连接器产品概述

FPC-05F-32PH20是讯普(XUNPU)针对高密度柔性连接需求推出的小型化连接器,聚焦轻薄化、易组装、高可靠三大核心特性,适配消费电子、工业控制等多领域的板间柔性连接场景。

一、产品定位与核心应用方向

该连接器精准匹配现代电子设备的小型化趋势,主要应用于:

  • 便携终端:智能手机、平板电脑的主板与显示模组、电池的柔性连接;
  • 智能穿戴:智能手表、蓝牙耳机的内部信号传输;
  • 工业控制:小型PLC、传感器节点的板间柔性布线;
  • 车载小型设备:车载显示屏、行车记录仪的内部连接(满足常规温区需求)。

二、关键参数与性能指标

FPC-05F-32PH20的参数设计兼顾实用性与紧凑性,核心指标如下:

参数项 规格参数 应用说明 触点数量 32Pin(32P) 支持多信号/小功率同步传输 引脚间距 0.5mm 高密度布局,减少PCB占用面积 安装方式 卧贴SMD 适配自动化贴片生产,一致性高 接入电缆厚度 0.3mm 兼容市场主流FFC/FPC电缆规格 板上高度 2mm 低profile设计,降低产品厚度 触头材质 磷青铜 弹性持久,抗疲劳性能优异 触头镀层 锡(Sn) 焊接牢固,接触电阻低 工作温度范围 -25℃ ~ +85℃ 覆盖常规工业/消费电子环境 额定电压/电流 50V AC/DC / 500mA 满足信号传输与小功率供电需求

三、设计特点与工艺优势

  1. 翻盖式锁定结构
    采用手动翻盖设计,无需工具即可操作:打开翻盖后可清晰对准触点,插入FPC/FFC后闭合翻盖(听到“咔嗒”声即锁定),既提升组装效率,又避免工具损伤电缆或连接器。

  2. 下接卧贴布局
    连接器贴装于PCB表面,FPC从下方接入,节省PCB正面空间(适合正面布局密集的产品),同时实现板间垂直/水平柔性连接,适配紧凑内部结构。

  3. 低高度紧凑设计
    板上高度仅2mm,远低于常规连接器的3mm以上高度,可有效降低产品整体厚度,满足智能穿戴等轻薄化设备的空间要求。

  4. 可靠触头设计
    磷青铜弹片触头弹性持久,长期使用不易变形;表面锡镀层保证焊接牢固性,同时减少接触电阻,降低信号损耗与发热。

四、安装与兼容性说明

安装流程

  1. 贴片阶段:通过SMT设备贴装于PCB焊盘,遵循常规SMD回流焊参数(温度峰值≤260℃,时间≤30s);
  2. 组装阶段:打开翻盖→将0.3mm厚FFC/FPC电缆端面对齐触点(无错位)→闭合翻盖锁定。

兼容性注意

  • 仅适配0.3mm厚度的FFC/FPC电缆(避免混用其他厚度);
  • 触点间距0.5mm,与1.0mm等大间距连接器不兼容;
  • 卧贴SMD安装,需与PCB贴片工艺匹配。

五、品牌与可靠性保障

讯普(XUNPU)作为国内专业连接器厂商,FPC-05F-32PH20经过多重可靠性测试:

  • 插拔寿命:≥500次(满足量产组装与后期维护需求);
  • 温湿度循环:通过-25℃~+85℃/95%RH的100次循环测试,性能稳定;
  • 振动测试:符合IEC 60068-2-6标准(10~2000Hz,1g加速度),适合工业环境。

该连接器凭借小型化、易组装、高可靠的特点,成为消费电子、工业控制等领域柔性连接的优选方案,可有效解决轻薄化产品的空间与连接可靠性问题。

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