Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FPC-05F-32PH20是讯普(XUNPU)针对高密度柔性连接需求推出的小型化连接器,聚焦轻薄化、易组装、高可靠三大核心特性,适配消费电子、工业控制等多领域的板间柔性连接场景。
该连接器精准匹配现代电子设备的小型化趋势,主要应用于:
FPC-05F-32PH20的参数设计兼顾实用性与紧凑性,核心指标如下:
参数项 规格参数 应用说明 触点数量 32Pin(32P) 支持多信号/小功率同步传输 引脚间距 0.5mm 高密度布局,减少PCB占用面积 安装方式 卧贴SMD 适配自动化贴片生产,一致性高 接入电缆厚度 0.3mm 兼容市场主流FFC/FPC电缆规格 板上高度 2mm 低profile设计,降低产品厚度 触头材质 磷青铜 弹性持久,抗疲劳性能优异 触头镀层 锡(Sn) 焊接牢固,接触电阻低 工作温度范围 -25℃ ~ +85℃ 覆盖常规工业/消费电子环境 额定电压/电流 50V AC/DC / 500mA 满足信号传输与小功率供电需求翻盖式锁定结构
采用手动翻盖设计,无需工具即可操作:打开翻盖后可清晰对准触点,插入FPC/FFC后闭合翻盖(听到“咔嗒”声即锁定),既提升组装效率,又避免工具损伤电缆或连接器。
下接卧贴布局
连接器贴装于PCB表面,FPC从下方接入,节省PCB正面空间(适合正面布局密集的产品),同时实现板间垂直/水平柔性连接,适配紧凑内部结构。
低高度紧凑设计
板上高度仅2mm,远低于常规连接器的3mm以上高度,可有效降低产品整体厚度,满足智能穿戴等轻薄化设备的空间要求。
可靠触头设计
磷青铜弹片触头弹性持久,长期使用不易变形;表面锡镀层保证焊接牢固性,同时减少接触电阻,降低信号损耗与发热。
讯普(XUNPU)作为国内专业连接器厂商,FPC-05F-32PH20经过多重可靠性测试:
该连接器凭借小型化、易组装、高可靠的特点,成为消费电子、工业控制等领域柔性连接的优选方案,可有效解决轻薄化产品的空间与连接可靠性问题。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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