WMSIC Electronic Components

XUNPU WAFER-HY2.0-2PZZ

ModelWAFER-HY2.0-2PZZ
PackageThrough-hole, P=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-HY2.0-2PZZ
Type
XUNPU
Minimum package
2000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-HY2.0-2PZZ
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.17g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
HY
Electronic Component
BM0227598284
Electronic Component
LCP
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-HY2.0-2PZZ线对板针座产品概述

一、产品定位与核心优势

WAFER-HY2.0-2PZZ是讯普(XUNPU)推出的单排2P直插式线对板针座,针对小间距、低功耗电子设备的稳定连接需求设计,核心优势聚焦于「紧凑空间适配、可靠电气性能、环境适应性强」三大维度,可满足多数中小型电子设备的内部线缆与PCB板的连接场景。

二、基础规格参数

该产品的核心基础参数清晰明确,适配标准电子设计规范:

  • 插针结构:1×2P(单排2针布局)
  • 针距:2.0mm(标准小间距设计,节省PCB空间)
  • 安装方式:直插式(DIP封装,手工/自动化焊接兼容)
  • 总PIN数:2P(单路电源/信号传输)
  • 外观尺寸:X轴(板上底边长度)6mm,Y轴(板上底边宽度)5.1mm,Z轴(板上高度)8mm(适配低高度设备)
  • 品牌与封装:XUNPU讯普,插件封装(针距P=2mm)
  • 颜色:白色(塑料底座,便于安装识别)

三、结构设计与材料特性

3.1 触头系统

触头采用黄铜材质+表面镀锡:

  • 黄铜的高导电率(约1.6×10⁻⁸Ω·m)保证信号/电流传输无损耗;
  • 锡镀层厚度均匀,既提升触头抗氧化能力(避免长期使用中氧化导致接触不良),又优化焊接兼容性(手工烙铁/回流焊易上锡,减少虚焊风险)。

3.2 塑料底座

底座选用LCP(液晶聚合物):

  • 耐高温性优异(工作温度范围与材料耐温匹配),可承受焊接高温而不变形;
  • 尺寸稳定性强,长期使用中不会因温度变化出现收缩/膨胀,保证针脚位置精准;
  • 阻燃等级达UL94V-0,能有效抑制火焰蔓延,提升设备安全等级。

四、电气性能参数

产品的电气指标经过严格测试,满足多数小型设备的连接需求:

  • 额定电流:2A(可稳定传输低压直流/交流小功率电流);
  • 额定电压:250V(符合民用/小型工业设备的电压规范);
  • 接触电阻:≤20mΩ(触头设计紧密,保证连接低阻抗)。

五、环境适应性

工作温度范围覆盖**-45℃至+85℃**,可适应多场景环境:

  • 低温场景:北方冬季户外设备(如小型气象传感器)、冷库内设备;
  • 高温场景:厨房小家电(如电水壶内部)、电子设备内部发热区域;
  • 湿度场景:LCP材质与镀锡触头均具备一定抗潮性,可在相对湿度≤95%的环境下稳定工作。

六、典型应用场景

该产品因紧凑设计与可靠性能,广泛应用于以下领域:

  1. 小型家电:加湿器、台灯、电热水杯等设备的内部电源/信号连接;
  2. 智能家居:智能门锁、温湿度传感器、智能开关的控制模块与线缆连接;
  3. 消费电子:耳机充电盒、智能手环、小型蓝牙音箱的内部组件连接;
  4. 小型工业控制:PLC辅助模块、小型传感器节点的线缆接口。

七、安装与使用注意事项

为保证产品性能与使用寿命,需注意以下要点:

  • 焊接规范:烙铁温度控制在300℃-350℃,单次焊接时间≤3秒,避免高温损坏塑料底座;
  • 插拔操作:避免过度用力插拔,防止触头变形或底座开裂;
  • 存储环境:存放于干燥、通风处(温度0℃-40℃,湿度≤60%),远离腐蚀性气体;
  • 安装对齐:直插时确保针脚与PCB焊盘完全对齐,避免短路或虚焊。

WAFER-HY2.0-2PZZ凭借「小间距、高可靠、易安装」的特点,成为中小型电子设备线对板连接的高性价比选择,可有效降低设备设计成本与空间占用。

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