WMSIC Electronic Components

XUNPU WAFER-PH2.0-4PZZ-Y62

ModelWAFER-PH2.0-4PZZ-Y62
PackageThrough-hole, P=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-4PZZ-Y62
Type
XUNPU
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-4PZZ-Y62
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.251g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
4P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0264595460
Electronic Component
PA66
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-4PZZ-Y62 产品概述

一、产品简介

WAFER-PH2.0-4PZZ-Y62 为 XUNPU(讯普)品牌的 PH2.0 系列 1×4 插针式连接器,间距 2.0mm,直插(插件)安装。该产品为 4P 单排直针结构,适用于对体积、可靠性和可插接性有要求的小电流连接场合,外形简洁,便于批量 PCB 装配与加工。

二、主要参数与材料

  • 插针结构:1×4P(单排 4 PIN)
  • 间距:2.0 mm(PH 系列标准)
  • 额定电流:2 A
  • 额定电压:200 V
  • 触头材质:铜合金;触头镀层:锡(良好焊接性与耐腐蚀性)
  • 塑料材质:PA66,阻燃等级 UL94V-2
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • 颜色:米色

三、结构与尺寸

  • 排数/每排针数:1 排 × 4 PIN
  • Z 轴(板上高度):6.0 mm(从 PCB 面到针端或塑壳基准)
  • X 轴(板上底边长度,间距线):10.0 mm
  • Y 轴(板上底边宽度):4.75 mm
  • 封装:插件,P = 2.0 mm
    以上尺寸便于在有限空间内实现可靠连接,兼容常见 PH2.0 系列母端接插件。

四、性能与可靠性

  • 适用于低至中等电流的信号与电源传输场景(额定 2A)。
  • 触头锡镀层提高焊接性与抗氧化能力,适合常规波峰或手工焊接工艺。
  • PA66 塑料具有良好机械强度与阻燃性能,适应一般电子设备工业环境。
  • 工作温度与材料配合可满足工业级环境下的长期可靠性要求。

五、配套与兼容性

  • 参考系列:PH(常见 2.0mm 间距接口)
  • 常用配套:WAFER-PH2.0-4PJK、WAFER-PH2.0-DZ 等公母对接件可互换或配套使用,便于线缆、端子排与传感器模块实现标准化连接。
  • 建议在采购与设计时核对母座/线端产品的外形与定位孔,以确保可靠配合。

六、典型应用场景

  • 消费电子与家用电器的信号/电源连接模块
  • 工业控制与仪表的低功率传感器接口
  • LED 灯条、电源模块、通信设备的内连接
  • 教育/开发板与原型机的通用连接器

七、安装与焊接建议

  • 该产品为直插(插件)类型,推荐 PCB 过孔直径依据 PCB 厚度与镀铜量调整,常用建议过孔直径约 0.9–1.0 mm(仅供参考,具体以样品调试为准)。
  • 支持手工焊与波峰焊;为保证焊点质量,建议使用合适助焊剂并在焊后清洁残留物。
  • 插拔配合时避免侧向用力,以延长塑壳与触头寿命。

八、包装与订购建议

  • 品牌:XUNPU(讯普)
  • 型号:WAFER-PH2.0-4PZZ-Y62(插件,P=2.0mm)
  • 订购时请注明包装数量、是否带脚位整列、以及是否需要特殊镀层或耐高温选项。
  • 如需样品、详细 2D/3D 尺寸图或可靠性测试数据,请联系供应商技术支持以获取完整资料。

如需进一步的 PCB 封装文件(Gerber/座标)、力学参数或测试报告,可提供具体设计图纸以便确认和优化匹配方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.