WMSIC Electronic Components

XUNPU WAFER-SH1.0-5PLB

ModelWAFER-SH1.0-5PLB
PackageSMD,P=1.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-SH1.0-5PLB
Type
XUNPU
Minimum package
1500

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-SH1.0-5PLB
Electronic Component
1
Package
SMD,P=1.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.31g
Electronic Component
1mm
Electronic Component
Electronic Component
PIN
5P
Electronic Component
1
Electronic Component
SH
Electronic Component
BM0259277889
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-SH1.0-5PLB 产品概述

一、产品简介

WAFER-SH1.0-5PLB 为 XUNPU(讯普)系列 1x5P 线对板立贴针座,间距(Pitch) 1.0mm,SMD 封装,适用于小型化线对板连接需求。该针座为单排 5PIN 设计,外形紧凑,适配现代微型电子产品的高密度布局要求,常用作线束、FFC/排线等对 PCB 的可靠连接接口。

二、主要参数

  • 插针结构:1x5P(单排 5PIN)
  • 间距:1.0mm(P=1.0mm)
  • 安装方式:立贴(SMD)
  • 额定电流:1A
  • 额定电压:50V
  • 工作温度:-40℃ ~ +85℃
  • 触头材质:黄铜(Brass),触头镀层:锡(Sn)
  • 塑料材质:LCP(液晶聚合物)
  • 颜色:米色
  • 附加特征:辅助焊脚(增强机械支撑)
  • 封装参考系列:SH
  • Z 轴(板上高度):4.4mm
  • X 轴(板上底边长度,间距线):7.35mm
  • Y 轴(板上底边宽度):3.05mm

三、结构与材料特点

触头采用黄铜基材并进行镀锡处理,兼顾导电性与焊接性,适合常规波峰或回流焊接。壳体选用 LCP,具备良好的耐热性与尺寸稳定性,能满足常见电子制造工艺的热循环要求。辅助焊脚在焊接过程中提供额外的机械固定,提升插拔与振动环境下的可靠性。

四、安装与焊接建议

  • 推荐采用标准 SMT 回流工艺装配,装贴时注意元件托盘方向与极性标识。
  • 辅助焊脚应在 PCB 布局时预留对应的焊盘,以强化机械牢固度。
  • 焊盘与阻焊开窗建议依照供应商提供的推荐 PCB 尺寸图设计,以保证焊接完整性与接触可靠性。
  • 由于额定电流 1A,应注意布局中电源/地线的耐流与散热路径,避免长期大电流工作引起发热。

五、应用场景与选型建议

适用于消费电子、便携设备、传感器模组、物联网终端、微型通讯设备等对体积和密度有要求的线对板连接场合。选型时若需更高电流或更高耐温性能,可考虑更大尺寸或不同镀层的产品;若空间更紧凑,可评估更细间距或角度型连接器。若需 PCB 尺寸图或 3D 模型,建议向供应商索取详细资料以便进行 DFM 校验。

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