WMSIC Electronic Components

XUNPU TYPEC-305-ACP16H458

ModelTYPEC-305-ACP16H458
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU TYPEC-305-ACP16H458
Type
XUNPU
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
TYPEC-305-ACP16H458
Electronic Component
1
Package
SMD
Electronic Component
USB Connector
Electronic Component
1.874g
(L)
14mm
Electronic Component
1
Electronic Component
BM0264968451
Electronic Component
Electronic Component
Operating Temperature
55℃~+85℃
Electronic Component
1
Electronic Component
1
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TYPEC-305-ACP16H458 产品概述

一、产品简介

TYPEC-305-ACP16H458 为 XUNPU(讯普)出品的 USB Type-C 母端连接器,侧贴(Side‑Mount)SMD 结构,面向需在 PCB 侧边实现 Type‑C 接口的紧凑型设备。基于 USB 3.1 规格的设计,兼顾高速信号传输与大电流供电能力,适用于移动设备、嵌入式终端、消费电子、工业控制等产品的接口方案。

二、主要参数与结构特点

  • 连接器类型:Type‑C(母)
  • 安装方式:侧贴(Side SMD)
  • 触点数量:16P
  • 端口数量:1
  • 额定电流(电源触点):5A
  • 插拔寿命:10,000次
  • 体长(L):14mm
  • 胶芯颜色:黑色
  • 工作温度:-55℃ ~ +85℃
  • 封装形式:SMD,品牌:XUNPU(讯普)

该型号在保持紧凑外形的同时,提供完整的 16 针触点布局,满足 USB 3.1 差分高速通道和电源/通用引脚的需要。

三、电气与可靠性特性

TYPEC-305-ACP16H458 支持 USB 3.1 高速信号设计,内部触点采用低接触电阻材料以保证稳定的信号完整性与供电能力。电源触点额定 5A,可满足移动设备快速充电与外设供电需求。插拔寿命 1 万次,适合需频繁插拔的使用场景。工作温度范围宽,适应商业级及部分工业级环境。

四、机械与封装信息

侧贴 SMD 封装有利于自动贴装与回流焊工艺,便于与表面贴装生产线配合。体长 14mm 的紧凑结构适合机壳边缘安装,节省内部空间。黑色胶芯提高耐脏污与外观一致性,金属壳体推荐接地焊盘以改善 EMI 与机械支撑。

五、应用场景与选型建议

适用于智能手机平板、笔记本扩展坞、便携设备、车载娱乐系统、工业控制终端与多口充电设备。选型时关注:

  • 是否需支持 USB 3.1 Gen2(10Gbps)或仅需 USB 2.0/3.0 兼容;
  • PCB 边缘厚度与壳体配合,确认侧贴高度与卡扣定位;
  • 供电电流要求是否超过 5A,若更高需考虑更大额定电流产品。

六、注意事项与焊接建议

  • 推荐按照厂商提供的 PCB 布局与焊盘尺寸进行设计,保证焊点可靠性与信号回流路径完整;
  • 回流焊时遵循常规无铅焊接曲线,避免过高温度或过长保温时间以防变形;
  • 装配时注意壳体接地焊点的焊接质量,以确保机械强度与屏蔽性能;
  • 存储与运输避免潮湿,按 SMD 零件标准防潮处理(如干燥箱保存),以免影响焊接品质。

总结:TYPEC-305-ACP16H458 以紧凑的侧贴 SMD 结构、完整的 16P 触点布局与 5A 电源能力,为需要高可靠、高密度 Type‑C 接口的产品提供了稳健、可量产的解决方案。若需详细尺寸、焊盘图或 3D 模型,可联系供应商获取完整数据包。

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