WMSIC Electronic Components

XUNPU WAFER-HY2.0-6PLB

ModelWAFER-HY2.0-6PLB
PackageSMD,P=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-HY2.0-6PLB
Type
XUNPU
Minimum package
600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-HY2.0-6PLB
Electronic Component
1
Package
SMD,P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
1.06g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
6P
Electronic Component
1
Electronic Component
HY
Electronic Component
BM0227352366
Electronic Component
LCP
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-HY2.0-6PLB线对板针座产品概述

一、产品基本定位与规格概况

WAFER-HY2.0-6PLB是讯普(XUNPU)品牌推出的单排6针(1×6P)线对板立贴针座,专为小型化电子设备的板间信号/电力传输设计。产品遵循HY系列2.0mm间距标准,采用SMD表面贴装(立贴式)安装方式,适配对应线端连接器实现可靠连接。核心规格明确:总PIN数6P、排数1、每排6针,是紧凑空间内多通道连接的优选组件。

二、核心电气与环境性能参数

1. 电气性能

  • 额定电流:2A/针脚,满足常规低功率设备的电力与信号传输需求;
  • 额定电压:250V,适配家用及工业低压电路场景;
  • 触头材质:黄铜基材+锡镀层,兼具良好导电性能与焊接适配性(锡镀层易与焊料结合,降低虚焊风险)。

2. 环境适应性

  • 工作温度:-25℃~+85℃,覆盖多数消费电子、工业小模块的使用环境;
  • 塑料外壳:采用LCP(液晶聚合物)材质,耐高低温、耐化学腐蚀,且可承受典型回流焊工艺温度(峰值约260℃,短时间内无变形)。

三、结构设计与关键尺寸特性

1. 结构优势

  • 内置辅助焊脚(附加特征):增强针座与PCB的焊接强度,有效提升抗振动、抗冲击性能,降低长期使用中脱落风险;
  • 立贴安装方式:Z轴垂直于PCB,节省平面空间,适合高密度PCB布局场景。

2. 关键尺寸(板上安装后)

  • Z轴高度:8.28mm(适配常规PCB厚度与周边组件间隙);
  • X轴长度(间距线方向):16mm(覆盖6针排列及辅助焊脚区域);
  • Y轴宽度:6.1mm(结构紧凑,减少PCB占用面积)。

四、典型应用场景

该针座因尺寸紧凑、性能可靠,广泛应用于:

  1. 消费电子:蓝牙耳机、移动电源、智能手环/手表的内部板间连接(信号+低功率电力传输);
  2. 小型家电:加湿器、桌面小风扇、智能台灯的控制板与功能模块连接;
  3. 工业控制:小型传感器模块(温度/湿度传感器)、微型MCU控制器的外部连接;
  4. 车载小模块:车载USB充电器、氛围灯控制器等小型车载电子设备的内部连接。

五、安装与使用注意事项

  1. 焊接工艺:适配SMD回流焊,需按标准温度曲线操作(LCP材质可承受回流焊峰值温度);
  2. 辅助焊脚:焊接时需确保辅助焊脚与PCB焊盘充分贴合,避免虚焊影响强度;
  3. 匹配线端:需搭配讯普HY系列2.0mm间距的6P线端连接器使用,确保连接兼容性;
  4. 环境防护:避免长期暴露在高湿度、腐蚀性气体中(触头锡镀层需注意防潮)。

该产品兼顾小型化设计与可靠性能,是消费电子、小型工业设备板间连接的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.