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SD-106M是讯普(XUNPU)针对便携设备、工业控制、车载电子等领域对SD卡连接的“轻薄化、高可靠、宽温适应”需求,推出的一款自弹式标准SD卡卡座。其核心价值在于:在保证数据传输稳定的前提下,通过紧凑设计适配小型化设备布局,同时宽温性能覆盖严苛应用场景,为不同行业用户提供便捷、耐用的存储扩展方案。
SD-106M的核心参数精准匹配多场景需求,具体如下:
参数类别 具体规格 备注说明 连接方式 自弹式 插入锁定,轻按弹出,操作无工具 兼容卡类型 标准SD卡(SD/SDHC/SDXC) 适配主流存储介质,兼容性强 封装形式 SMD(表面贴装) 支持自动化生产,提升焊接效率 本体尺寸 最大高度2.9mm 轻薄设计,适配小型化设备 工作温度范围 -45℃ ~ +85℃ 覆盖工业级、车载等严苛环境 接触电阻 ≤30mΩ(初始) 保证数据传输低损耗 插拔寿命 ≥10000次 长期使用可靠性高 环保标准 RoHS 2.0 compliant 符合欧盟环保要求SD-106M在结构设计上兼顾“便捷性、稳定性、小型化”,具体优势如下:
自弹式操作体验
采用弹簧锁定结构,SD卡插入时自动卡紧,避免振动松动;轻按卡身即可弹出,无需额外工具,提升手持设备、车载终端等场景的操作效率。
超轻薄本体设计
本体最大高度仅2.9mm,比常规SD卡座缩小约15%,可适配智能终端、PLC模块等内部空间紧凑的设备,满足小型化产品的布局需求。
宽温环境可靠性
工作温度覆盖-45℃至+85℃,可稳定应对:
SMD封装适配自动化生产
表面贴装设计无需插件工序,可直接通过回流焊焊接,提升生产效率的同时,减少人工误差,保证焊接良率,适合大规模量产。
高可靠接触性能
接触端子采用高弹性磷铜材料,表面镀金处理(厚度≥0.3μm),有效降低接触电阻,减少数据传输中断风险;端子结构优化,可承受轻微振动,适配车载、工业等振动环境。
SD-106M凭借多维度优势,广泛应用于以下领域:
讯普(XUNPU)作为专注连接器领域10余年的品牌,SD-106M经过多重可靠性测试:
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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