WMSIC Electronic Components

XNRUSEMI XR100N03F

ModelXR100N03F
PackagePDFN5060-8L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR100N03F
Type
XNRUSEMI
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR100N03F
Electronic Component
1
Package
PDFN5060-8L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.177g
Electronic Component
1
Electronic Component
BM0264844057
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
75W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR100N03F 产品概述

一、产品简介

XR100N03F 是 XNRUSEMI(新锐)推出的一颗高单元密度沟槽式 N 沟道 MOSFET,额定漏源电压 Vdss = 30V,连续漏极电流 Id = 100A,典型导通电阻 RDS(on) = 3.6mΩ(VGS=10V)。封装为 PDFN5060-8L,工作温度范围 -55℃~+150℃,符合 RoHS 与绿色产品要求,并提供 100% EAS 保证及完整功能可靠性认证,专为大多数同步降压转换器与高效率功率管理场景设计。

二、关键电气参数(典型/额定)

  • 漏源电压:30V
  • 连续漏极电流:100A
  • 导通电阻:3.6mΩ @ VGS=10V
  • 耗散功率:75W
  • 阈值电压:VGS(th) = 2.5V
  • 总栅极电荷:Qg = 48nC @ 10V
  • 输入电容:Ciss = 2.764nF
  • 输出电容:Coss = 289pF
  • 反向传输电容:Crss = 265pF

三、产品亮点与应用价值

  • 低 RDS(on) 与较高电流承载能力,适合高效率、低导通损耗的同步整流与降压电源。
  • 合理的栅极电荷(48nC)在保证开关速度的同时兼顾驱动功耗,适用于中高开关频率应用。
  • 紧凑 PDFN5060-8L 封装有利于系统高密度布板与良好导热,有助于散热管理与功率密度提升。
  • 通过 RoHS 与可靠性认证,适合工业与消费类电源模块使用。

四、应用场景

  • 同步降压转换器(主开关或同步整流)
  • 服务器与通信电源管理模块
  • 高性能DC-DC转换、负载开关与电机驱动前级
  • 电池供电系统与便携设备电源

五、设计建议与注意事项

  • 为了达到标称 RDS(on),建议栅极驱动电压采用 10V;若仅以逻辑电平(如 4.5V)驱动,导通电阻会显著上升,应在选型时验证实际导通损耗。
  • Qg=48nC 表明驱动器需具备相应峰值驱动能力,设计时计算驱动损耗 P = Qg·Vdrive·fSW。高频应用推荐使用低阻抗、高峰值电流的栅极驱动器,并根据 EMI 与振铃情况配置合适的栅阻。
  • 布局方面尽量缩短功率回路(尤其是源-漏电流回路)以降低寄生电感,使用足够的铜厚与过孔增强散热;若需并联器件,确保门极匹配与电流均分。
  • 注意热设计:尽管器件 Pd 标称为 75W,实际可用耗散能力强烈依赖于 PCB 散热、封装接地与环境条件,请参照完整数据手册中的 RθJA/RθJC 与 SOA 曲线进行热仿真与裕度评估。
  • 在开关瞬态中,Coss 与 Crss 会影响回收与能量吸收,需根据应用评估能量回流管理(如合适的续流二极管、RC 缓冲或吸收网络)。

综上,XR100N03F 在 30V 级别功率管理领域以低 RDS(on) 与良好单元密度提供优秀的能效与开关性能,适合用于高效率同步降压与各类中高功率开关电源设计。若需详细的热阻、极限值与开关性能曲线,请参照完整数据手册或联系厂家技术支持。

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