WMSIC Electronic Components

XNRUSEMI XR40P06

ModelXR40P06
PackageTO-252-3L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR40P06
Type
XNRUSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR40P06
Electronic Component
1
Package
TO-252-3L
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.466g
Electronic Component
1
Electronic Component
BM0265389787
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
79W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR40P06 P沟道MOSFET产品概述

新锐半导体(XNRUSEMI)推出的XR40P06是一款针对低压中等功率场景优化的P沟道增强型MOSFET,凭借平衡的导通损耗、开关特性及宽温度适应性,适用于工业控制、汽车电子、消费电子等多个领域。以下从核心参数、封装特性、应用场景等维度展开概述。

一、核心参数总览

XR40P06的关键电参数精准匹配低压高电流需求,核心指标如下:

  • 漏源电压(Vdss):60V,覆盖12V/24V/48V主流低压系统,余量充足(如48V系统允许55V输入波动);
  • 连续漏极电流(Id):25℃时40A,支持中等功率负载连续工作(如多个12V/3A负载并联);
  • 导通电阻(RDS(on)):29mΩ@10V Vgs,P沟道器件中属于低阻水平,显著降低导通损耗、减少发热;
  • 耗散功率(Pd):79W(25℃),配合封装散热能力满足短时间过载需求;
  • 阈值电压(Vgs(th)):2.5V@250uA,与3.3V/5V MCU IO口直接兼容,无需额外栅极驱动电路;
  • 栅极电荷量(Qg):68nC@10V Vgs,开关损耗适中,适合非极端高速开关场景(如负载开关而非高频电源)。

二、封装与温度特性

XR40P06采用TO-252-3L贴片封装,兼具紧凑性与散热能力:

  • 尺寸紧凑(典型10.1×7.6×1.6mm),适配自动化贴片生产,节省PCB空间;
  • 引脚散热设计(中间漏极引脚面积大),可通过PCB铜箔增强散热,支撑79W功率耗散;
  • 工作温度范围**-55℃+175℃**,覆盖工业级(-40+85℃)和汽车级(-40~+150℃)需求,适合极端环境(如户外工业设备、汽车发动机舱周边)。

三、典型应用场景

XR40P06的参数特性使其在多场景具备实用性:

  1. 低压负载开关:12V/24V系统电源开关(如汽车座椅加热、车载充电器、工业传感器电源),40A连续电流满足多负载并联;
  2. 电池保护电路:便携式设备(电动工具、储能电池)充放电开关,P沟道可直接接电池正极,简化电路;
  3. DC-DC转换器:48V转12V升压电路高边开关,或12V转5V降压电路同步整流(配合N沟道器件);
  4. 小功率电机驱动:直流无刷电机(BLDC)辅助驱动,或小型伺服电机正反转控制;
  5. LED照明调光:低压LED灯带调光开关,低RDS(on)减少发热,宽温范围适合户外照明。

四、性能优势解析

  1. 低导通损耗与高功率密度:29mΩ低阻配合TO-252封装,紧凑空间内实现79W输出,无需大型散热片;
  2. 宽温可靠性:-55~+175℃范围确保极端环境下性能稳定,降低失效风险;
  3. 易驱动性:2.5V阈值电压兼容3.3V/5V MCU,无需栅极驱动IC,简化设计、降低成本;
  4. 平衡开关特性:68nC栅极电荷避免高速开关EMI问题,同时保证负载切换响应速度(典型100ns级)。

五、应用注意事项

  1. 栅极电压限制:避免Vgs超过额定值(通常P沟道Vgs最大-20V),防止栅极氧化层击穿;
  2. 散热设计:连续40A工作时,PCB漏极区域需铺1oz以上铜箔,或加装小型散热片;
  3. 静电防护:MOSFET易受静电损坏,焊接时接地,存放用防静电包装;
  4. 电流降额:温度超25℃时,按热阻(典型Rθja=1.5℃/W)降额,如100℃时最大连续电流约20A;
  5. 电压匹配:负载电压不得超60V,否则可能击穿器件。

总结:XR40P06是一款性价比突出的P沟道MOSFET,针对低压中等功率场景优化,具备宽温、低阻、易驱动等特点,适用于工业、汽车、消费电子等领域的负载开关、电源转换等应用。

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