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XNRUSEMI XR3402B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR3402B
- Type
- XNRUSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR3402B
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264844070
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 850mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR3402B 产品概述
XR3402B 是 XNRUSEMI（新锐）推出的一款高单元密度沟槽式 N 沟道 MOSFET，采用 SOT-23 封装，专为小功率开关与负载开关应用优化。器件在 30V 漏源电压 (Vdss) 下，可提供 2A 连续漏极电流 (Id)，在 Vgs=10V 时典型导通电阻仅 98mΩ，兼顾低导通损耗与小封装的热限制，适合便携式与空间受限的电源管理场景。
一、主要规格（典型/额定）
- 类型：N 沟道 MOSFET
- 漏源电压 Vdss：30V
- 连续漏极电流 Id：2A
- 导通电阻 RDS(on)：98mΩ @ Vgs=10V
- 耗散功率 Pd：850mW（SOT-23 封装热极限）
- 阈值电压 Vgs(th)：1V（典型）
- 总栅极电荷 Qg：2.7nC @ Vgs=4.5V
- 输入电容 Ciss：184pF；输出电容 Coss：38pF；反向传输电容 Crss：28pF
- 工作温度范围：-55℃ ~ +150℃
- RoHS 与绿色环保合规，通过全功能可靠性认证
二、产品特性与优势
- 沟槽式高单元密度工艺，单位面积导通电阻低，提升效率并减少导通损耗。
- SOT-23 小封装适配高密度 PCB 布局，便于便携设备与模块化电源设计。
- 低阈值（≈1V）有利于低电压驱动场景；但需注意 RDS(on) 给定值为 Vgs=10V，4.5V 驱动下导通电阻会增大。
- 低栅极电荷（2.7nC @4.5V）有利于降低开关驱动能耗与快速切换需求。
三、典型应用
- 负载开关、电源路径选择与电池管理（PMIC）
- 小功率 DC-DC 降压/升压转换器的同步/非同步开关
- 移动设备、物联网终端、便携仪器的电源开关与保护
- LED 驱动与小电机驱动等对体积与效率有要求的场景
四、注意事项与设计建议
- 热管理：SOT-23 封装 Pd=850mW，需要合理拓展 PCB 铜箔面积与热散布，避免长期大电流下过热。
- 驱动电压：若系统仅提供 4.5V 驱动，建议评估在 Vgs=4.5V 下的 RDS(on) 并确认热耗；若可能优先使用接近 10V 的栅极驱动以达到标称 RDS(on)。
- 开关速度与 EMI：较低的 Ciss（184pF）和 Qg 有利于快速切换，但建议在高速开关时加串联栅极电阻与适当布局，并做好去耦以抑制振铃与 EMI。
- 保护与极限：器件 Vdss=30V，请确保在瞬态与浪涌条件下电压不会超出极限；若需承受能量吸收，请参考厂方完整可靠性与击穿特性说明。
XR3402B 以其小封装、低 Qg 与较低 RDS(on) 的特性，在需兼顾体积与效率的小功率开关场景中表现优异，适合用于消费类电子与工业控制等多种应用。若需封装图、典型应用电路或温度特性曲线，可联系供应商获取完整规格书与可靠性报告。
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