Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XNRUSEMI XR2318
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR2318
- Type
- XNRUSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR2318
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0264844142
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.6W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR2318 产品概述
一、概述
XR2318 是 XNRUSEMI（新锐）推出的一款高单元密度沟槽式 N 沟道 MOSFET，额定漏源电压 40V，适用于同步降压转换器及各类开关电源场合。器件符合 RoHS 与绿色产品要求，并经 100% 全功能可靠性保证，适合工业与消费电子的中小功率设计。
二、主要参数
- 类型：N 沟道
- 漏源电压 Vdss：40V
- 连续漏极电流 Id：5A
- 导通电阻 RDS(on)：40mΩ @ Vgs=10V
- 阈值电压 Vgs(th)：2.2V
- 总栅极电荷 Qg：11nC @10V
- 输入电容 Ciss：435pF；反向传输电容 Crss：35pF；输出电容 Coss：58pF
- 耗散功率 Pd：1.6W
- 工作结温范围：-55℃ ~ +150℃
- 封装：SOT-23
三、性能特点
XR2318 在导通电阻与栅极电荷之间取得平衡：在 Vgs=10V 驱动下具有较低的 RDS(on)，可有效降低导通损耗；中等 Qg 与 Ciss 值利于在中高频率下保持较好的开关性能。小封装利于高密度 PCB 布局与自动化贴装。
四、典型应用
适合作为同步降压转换器的低侧开关、便携电源管理、升降压转换器以及各类需要 40V 等级、几安培电流能力的小功率开关应用场景。建议在 10V 门驱动条件下使用以达到标称导通电阻性能。
五、布局与热管理建议
SOT-23 封装体积小，Pd=1.6W 在无散热片条件下受限，建议在 PCB 上为 MOSFET 提供充足的散热铜箔，优化电源回路宽厚铜层以降低寄生电感与温升。门极驱动器应具备足够电流以快速驱动 Qg，避免过长上升/下降时间引起开关损耗增加。
六、采购与合规
品牌：XNRUSEMI（新锐）；符合 RoHS 与绿色产品要求。具体引脚排列、最大额定值及时序等请参考厂方完整数据手册以完成最终设计验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
