WMSIC Electronic Components

XNRUSEMI XR2300

ModelXR2300
PackageSOT23
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR2300
Type
XNRUSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR2300
Electronic Component
1
Package
SOT23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0264844059
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR2300 产品概述

一、产品简介

XR2300 是 XNRUSEMI(新锐)推出的一款高单元密度沟槽式 N 沟道 MOSFET,专为小功率开关与负载开关设计。器件在 SOT-23 小封装下提供优异的导通性能与开关效率,适用于便携式设备、电源管理与保护电路等空间受限的应用场景。符合 RoHS 与绿色环保要求,并通过全功能可靠性认证。

二、主要电气参数

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:20 V
  • 连续漏极电流 Id:5.2 A
  • 导通电阻 RDS(on):44 mΩ @ Vgs = 2.5 V
  • 阈值电压 Vgs(th):1.0 V
  • 总栅极电荷 Qg:5.6 nC @ 10 V
  • 输入电容 Ciss:358 pF;反向传输电容 Crss:58.5 pF
  • 功耗 Pd:1 W
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23(单片封装,便于自动贴装)

三、特性与优势

  • 低导通电阻:44 mΩ @ 2.5 V 的低 RDS(on) 在低电压驱动下即可获得较小的导通损耗,提升系统效率并降低发热。
  • 低栅极电荷与适中输入电容:Qg = 5.6 nC 与 Ciss = 358 pF 平衡了驱动能耗与开关速度,适合采用轻量级驱动方案的系统。
  • 宽工作温度:-55 ℃ 至 +150 ℃ 的耐温能力保证在苛刻环境下仍能稳定工作。
  • 小型封装:SOT-23 有利于高密度布局与节省 PCB 面积,适配便携与消费类电子设计。
  • 可靠合规:满足 RoHS 与绿色产品要求,并通过全功能可靠性认证,便于量产导入与长期供货。

四、典型应用场景

  • 便携式电源开关与负载开关(电池切换、备用电源管理)
  • USB/Type-C 功率路径控制与过流保护电路
  • DC-DC 转换器的低侧开关或同步整流器(在功率要求适中时)
  • 工业控制与传感器供电开关,要求低损耗与高可靠性的场合

五、使用建议与注意事项

  • 驱动电压:为获得标称 RDS(on),建议 Vgs ≥ 2.5 V;若以更低电压驱动,需评估导通电阻和热耗散。
  • 热管理:器件 Pd = 1 W,SOT-23 封装下应通过铜箔散热与合理的 PCB 走线设计来降低结温,避免长期大电流连续导通导致过热。
  • 开关布局:考虑 Crss 与 Ciss 对电磁干扰与开关振铃的影响,必要时在栅极串联适当电阻或加入阻尼网络。
  • ESD 与可靠性:在装配和调试时注意静电防护,遵循器件可靠性规范以延长使用寿命。

六、封装与采购信息

  • 型号:XR2300
  • 封装形式:SOT-23,适合自动贴装与回流焊工艺
  • 包装与认证:符合 RoHS、绿色环保要求,并通过厂方全功能可靠性认证;可提供样品与批量供货支持。

如需详细的电气特性曲线、封装尺寸图或典型应用电路图,可联系 XNRUSEMI(新锐)技术支持获取完整数据手册与设计参考。

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