Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR2320L 是 XNRUSEMI(新锐)推出的一款高单元密度沟槽式 N 沟道 MOSFET,封装为 SOT23-3L,专为小功率开关与负载开关应用设计。器件在低栅压下仍能提供优异的导通电阻与开关效率,适合便携、电源管理与电机驱动的轻载场景。符合 RoHS 要求并通过全功能可靠性认证。
XR2320L 在低栅压下(2.5V)即可达到 20mΩ 的低 RDS(on),适合直接由 MCU 或低压逻辑驱动。总栅极电荷 Qg=15nC(4.5V)表明在高速开关时需要考虑驱动能力与驱动损耗。较大的 Ciss(700pF)和 Crss(114pF)提示在高频切换中需优化驱动器和走线以降低开关损耗与振铃。
SOT23-3L 封装体积小、散热受限,器件耗散功率典型为 2W,实际使用中应评估 PCB 铜箔面积和焊盘热阻以保证热量能有效传导。长时间高电流工况下建议增加散热铜箔、短路径回流及布局靠近地平面。
产品符合 RoHS 与绿色环保要求,并已通过厂内全功能可靠性认证,适合对质量与寿命有稳定需求的量产项目。
总结:XR2320L 在 SOT23-3L 小封装中提供低 RDS(on) 与适合低压逻辑驱动的性能,是移动与低功率电源管理、负载切换等应用的良好选择。在设计时应注意栅极驱动能力、开关损耗与热管理措施,以发挥其最佳性能。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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