WMSIC Electronic Components

XNRUSEMI XR120N03D

ModelXR120N03D
PackagePDFN3333-8L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR120N03D
Type
XNRUSEMI
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR120N03D
Electronic Component
1
Package
PDFN3333-8L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.111g
Electronic Component
1
Electronic Component
BM0264844084
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
88W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR120N03D 产品概述

一、概述

XR120N03D 是一款高单元密度沟槽式 N 沟道 MOSFET,由 XNRUSEMI(新锐)生产,面向同步降压转换器及高电流开关应用。该器件在 30V 漏源电压等级下提供极低导通电阻与良好的栅极电荷特性,适用于需要高效率与高开关速度的电源管理场景。产品符合 RoHS 与绿色环保要求,100% 保证 EAS,并通过全功能可靠性认证。

二、主要规格

  • 类型:N 沟道 MOSFET
  • 漏源电压 (Vdss):30V
  • 连续漏极电流 (Id):120A
  • 导通电阻 (RDS(on)):3.1 mΩ @ Vgs = 10V
  • 栅极阈值电压 (Vgs(th)):2.2V
  • 栅极电荷量 (Qg):72 nC @ 10V
  • 输入电容 (Ciss):4 nF
  • 反向传输电容 (Crss):396 pF
  • 输出电容 (Coss):437 pF
  • 功耗耗散 (Pd):88W
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:PDFN3333-8L

三、性能亮点

  • 低 RDS(on):3.1 mΩ 的低导通电阻可显著降低导通损耗,适合大电流路径与低压差场合。
  • 平衡的开关特性:较高的栅极电荷 (72 nC@10V) 与中等 Ciss/Crss 值,兼顾开关损耗与电磁兼容设计的灵活性。
  • 宽工作温度与高功耗能力:88W 的耗散能力与 -55~150℃ 的耐温范围,适合工业及汽车类恶劣环境(需配合散热设计)。
  • 可靠性与环保:符合 RoHS,100% EAS 保证及全功能可靠性认证,适合对可靠性有严格要求的商业化量产。

四、典型应用

  • 同步降压(同步整流)转换器的高端/低端开关器件
  • DC-DC 电源模块、服务器与通信设备电源管理
  • 电机驱动与功率开关阵列(短时高电流场合)
  • 电池管理与负载开关、电源分配系统

五、设计与使用建议

  • 栅极驱动:为达到标称 RDS(on),建议采用 Vgs = 10V 的驱动电平。由于 Qg=72 nC,驱动器需具备足够电流能力以保持快速开关并控制功耗。
  • 开关频率与损耗折中:较大的 Qg 与 Crss 意味着在高频下开关损耗增长明显,建议在高频应用中优化驱动电路、加入合适的栅极电阻或软启动策略。
  • 散热管理:尽管 Pd 标称为 88W,实际散热能力强烈依赖 PCB 布局与封装到环境的热阻(PDFN3333-8L)。建议使用大面积铜箔、热盲孔(vias)和必要的散热器以保证可靠工作。
  • 并联与保护:需更高电流时可并联使用,但应注意栅极驱动的一致性与退耦、并联时加入小阻值的散热与电流均流措施。建议在设计中加入过流/过温保护与合适的软关断方案。

六、封装与采购信息

  • 品牌:XNRUSEMI(新锐)
  • 封装型号:PDFN3333-8L,适合高密度 PCB 布局与良好的热性能。
  • 合规性:RoHS、绿色产品;100% EAS 保证并通过全面可靠性验证。

总结:XR120N03D 以其低 RDS(on) 与强电流承载能力,在 30V 级别的同步降压及高性能电源管理中具有竞争力。合理的栅极驱动与良好的散热设计可充分发挥其效率与可靠性优势。若需更具体的封装热阻、极限参数或典型应用电路,建议参考器件数据手册或联系供应商获取完整技术资料。

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