Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XNRUSEMI XR2300A
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR2300A
- Type
- XNRUSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR2300A
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0264844110
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR2300A 产品概述
一、产品简介
XR2300A 是 XNRUSEMI（新锐）推出的一款高单元密度沟槽式 N 沟道 MOSFET，专为小功率开关和负载开关场景设计。器件额定漏源电压 20V，连续漏极电流 6A，兼顾低导通损耗与小封装解决方案，适用于空间受限但需要较好效率的电源与开关电路。
二、主要性能参数
- 类型：N 沟道 MOSFET
- Vdss（漏源耐压）：20V
- Id（连续漏极电流）：6A
- RDS(on)（导通电阻）：60mΩ @ Vgs=2.5V
- Vgs(th)（阈值电压）：1.2V
- Pd（耗散功率）：1W
- Qg（总栅极电荷）：4.6nC @ Vgs=4.5V
- Ciss（输入电容）：310pF；Coss（输出电容）：310pF；Crss（反向传输电容）：49pF
- 工作温度范围：-55°C ~ +150°C
- 封装：SOT-23
- 认证：RoHS、绿色产品，并通过全功能可靠性认证
三、应用场景
适用于便携式设备电源开关、负载开关、转换器低压侧开关、通用开关管、背光驱动与电池管理系统等需要在有限封装内实现低导通损耗的场合。
四、封装与热管理
SOT-23 体积小巧，适合高密度 PCB 布局。器件额定耗散功率为 1W，实际应用中需注意 PCB 散热设计：加大铜箔面积、合理走热通道或采用过孔下沉热量，以避免长期高温导致性能退化。
五、设计与选型建议
- 若驱动电压可达 2.5V，可获得标称 RDS(on) 性能；若栅极驱动受限，需关注导通电阻上升带来的功耗。
- 栅极电荷 Qg 适中，开关速度与驱动功耗之间平衡良好；驱动器应能提供峰值电流以缩短开关时间，减小过渡损耗。
- 在超过 6A 或对导通损耗要求更高的场合，可考虑并联或选择更低 RDS(on) 器件。
六、可靠性与合规
XR2300A 满足 RoHS 与绿色产品要求，并通过了全面的可靠性认证，适合工业级与消费类产品长期可靠使用。总体而言，该器件在小功率开关应用中提供了性能与成本的平衡，是替换传统更大封装 MOSFET 的优选。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
