WMSIC Electronic Components

XNRUSEMI XR30N10B

ModelXR30N10B
PackageTO-252-3L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR30N10B
Type
XNRUSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR30N10B
Electronic Component
1
Package
TO-252-3L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0264974415
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
42W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR30N10B 产品概述

一、主要参数

  • 类型:沟槽式 N 沟道 MOSFET(单只)
  • 漏源电压 Vdss:100 V
  • 连续漏极电流 Id:30 A
  • 导通电阻 RDS(on):37 mΩ @ VGS=10 V
  • 阈值电压 VGS(th):1.5 V
  • 栅极电荷 Qg:20 nC(测量条件 80 V)
  • 输入电容 Ciss:1.964 nF;输出电容 Coss:90 pF;反向传输电容 Crss:74 pF
  • 耗散功率 Pd:42 W
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:TO-252-3L(DPAK)
  • 符合 RoHS,100% 保证雪崩能量

二、产品特点

XR30N10B 为高性能沟槽 N 沟道 MOSFET,单元密度高,导通电阻在典型同步降压应用下表现优异。较低的 RDS(on) 与中等栅极电荷实现了导通损耗与开关损耗之间的良好平衡。器件通过雪崩能量100%测试,可靠性高,适合对抗拥塞与瞬态应力的电源拓扑。

三、典型应用场景

  • 同步降压转换器(低侧或高侧配合驱动)
  • DC-DC 电源模块与服务器电源
  • 功率管理与电源开关
  • 电机驱动与负载开关
  • 汽车与工业电子(注意整车等级要求和额外认证)

四、设计与使用建议

  • 驱动电压:建议使用 8–12 V 的栅极驱动以获得标称 RDS(on)。VGS(th)=1.5 V 表明器件并非严格逻辑电平驱动器件,低电压驱动时 RDS(on) 会显著上升。
  • 开关损耗管理:Qg=20 nC 对应中等驱动需求,开关频率较高时需选择足够驱动能力的驱动器并优化驱动阻抗与回路寄生电感。
  • 布局:栅极、源极走线要尽量短,功率回路采用宽铜箔与散热过孔以降低寄生电感并提升热扩散;若作为低侧同步整流,建议使用 Kelvin 源连接以提高电流检测精度。
  • 热管理:虽然 Pd=42 W(典型条件)但实际应用中要基于 PCB 铜面积、散热条件与温升评估结‑壳、结‑环境热阻,必要时采用散热片或加大铜箔。
  • 可靠性与限制:雪崩能量已保证,但仍需参考完整数据手册的最大 VGS、SOA 与脉冲额定值进行稳健设计。

五、封装与可靠性说明

TO-252-3L(DPAK)适合表面贴装的功率器件安装方式,便于自动化组装和较好散热至 PCB。器件工作温度范围宽,适合工业级场合,并通过 RoHS 绿色合规与 100% 雪崩能量保证,适配对可靠性要求较高的电源设计。

六、选型参考

若目标是更低导通损耗,可选 RDS(on) 更低但 Qg 更大的器件;若追求高速开关与更低驱动能耗,可优先考虑 Qg 更小且 Crss 更低的型号。最终选型需在导通损耗、开关损耗、驱动能力与热设计之间权衡。

品牌:XNRUSEMI(新锐),型号 XR30N10B。更多电气特性、波形测试与封装尺寸请参考产品规格书以完成详细设计验证。

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