WMSIC Electronic Components

XNRUSEMI XR10N06S

ModelXR10N06S
PackageSOP8
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR10N06S
Type
XNRUSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR10N06S
Electronic Component
1
Package
SOP8
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.183g
Electronic Component
1
Electronic Component
BM0264974419
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
4W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR10N06S N沟道MOSFET产品概述

一、核心参数总览

XR10N06S是新锐半导体(XNRUSEMI)推出的N沟道增强型MOSFET,核心参数覆盖电压、电流、导通特性及温度适应性,具体如下:

  • 电压电流基础:漏源极最大耐压(Vdss)60V,连续漏极电流(Id)10A,满足12V/24V等低压中功率应用的核心需求;
  • 导通损耗:Vgs=15V时导通电阻(RDS(on))仅34.5mΩ,低电阻可显著降低导通功率损耗(如10A电流下损耗约3.45W);
  • 功耗与温度:最大耗散功率(Pd)4W,工作温度范围-55℃~+150℃,支持工业级极端环境;
  • 开关特性:栅极电荷量(Qg)14nC(Vgs=30V时),输入电容(Ciss)825pF、输出电容(Coss)49pF、反向传输电容(Crss)41pF,参数优化了开关速度;
  • 驱动兼容性:阈值电压(Vgs(th))1.6V(典型值),兼容3.3V/5V MCU GPIO,无需额外升压电路。

二、封装与可靠性

XR10N06S采用SOP-8贴片封装,兼具小型化与可靠性:

  • 空间优势:引脚间距1.27mm,封装尺寸紧凑(约6mm×5mm),适合便携式设备、小型电源模块等对空间敏感的场景;
  • 生产适配:支持自动化表面贴装工艺,贴装效率高,降低批量生产人工成本;
  • 散热可靠性:SOP-8引脚布局利于热量传导,配合PCB漏极散热焊盘(建议≥10mm²铜箔)可有效控制结温,结合-55℃~+150℃宽温范围,长期工作稳定性强。

三、典型应用场景

XR10N06S的参数特性使其适用于多种低压中功率场景:

  1. 车载系统:12V车载DC-DC转换器、电池管理电路(BMS)的充放电开关;
  2. 消费电子:小型充电器、移动电源的升压/降压模块;
  3. 电机驱动:扫地机器人、小型家电的直流电机驱动(10A以内电流需求);
  4. LED照明:中功率LED驱动电源的恒流控制开关;
  5. 工业控制:小型PLC的IO驱动、传感器信号放大电路。

四、性能优势解析

  1. 低损耗高效:34.5mΩ低导通电阻搭配1.6V低阈值,导通损耗比同类40mΩ以上产品低10%左右,系统效率提升明显;
  2. 快速开关:14nC栅极电荷量及低Crss(41pF),开关速度快,适合100kHz以上的高频开关电源应用;
  3. 宽温适应性:覆盖-55℃~+150℃,支持车载低温启动、户外设备高温工作等极端场景;
  4. 驱动简化:低阈值电压兼容MCU GPIO(3.3V/5V),无需额外驱动电路,缩短设计周期;
  5. 成本优化:SOP-8封装性价比高,适合批量生产的成本控制需求。

五、使用注意事项

为保证长期可靠性,需注意以下要点:

  1. 驱动电压:建议Vgs≥4V(避免接近阈值导致导通不充分),推荐10V-15V以获得最小导通电阻;
  2. 散热设计:连续10A工作时损耗约3.45W,需在漏极引脚处增加散热铜箔或小型散热片;
  3. 静电防护:MOSFET易受静电损坏,生产/存储需使用防静电包装、手环及台垫;
  4. 过压防护:漏源电压不得超过60V,可并联60V TVS管防止过压击穿;
  5. 电流限制:连续漏极电流不得超过10A,瞬时脉冲电流需参考新锐官方datasheet的脉冲参数(如1ms脉冲下最大电流)。

XR10N06S凭借低损耗、宽温适应性及驱动兼容性,成为低压中功率应用的高性价比选择,适用于车载、消费电子及工业控制等多领域。

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