WMSIC Electronic Components

XNRUSEMI XR190N04

ModelXR190N04
PackageTO252-3L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR190N04
Type
XNRUSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR190N04
Electronic Component
1
Package
TO252-3L
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.471g
Electronic Component
1
Electronic Component
BM0264974408
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
61W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
40V
Capacitor(Ciss)
4.9nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR190N04 N沟道MOSFET产品概述

XR190N04是新锐半导体(XNRUSEMI)推出的一款中低压大电流N沟道增强型MOSFET,针对消费电子、工业电源等领域的功率控制需求优化设计,具备低导通电阻、高连续漏极电流、宽温度适应范围等核心优势,可稳定应用于多种严苛场景。

一、核心特性亮点

XR190N04的设计重点围绕大电流承载与低损耗展开,关键特性包括:

  1. 高电流能力:40V耐压下支持190A连续漏极电流(25℃环境),覆盖多数中低压大电流负载场景;
  2. 低导通损耗:栅压10V时导通电阻仅2.7mΩ(测试电流57A),大幅降低导通阶段功率损耗,提升效率;
  3. 开关特性均衡:栅极总电荷(Qg)80nC@20V,输入电容(Ciss)4.9nF,反向传输电容(Crss)317pF,兼顾开关速度与驱动损耗,适合kHz级中等频率应用;
  4. 宽温可靠性:工作结温范围-55℃~+150℃,满足工业级、车载级等严苛环境要求;
  5. 紧凑封装:采用TO-252-3L(DPAK)贴片封装,体积小巧,便于集成到空间紧凑的电路设计中。

二、关键参数解析

1. 耐压与电流参数

  • 漏源击穿电压(Vdss):40V,适配12V/24V等中低压系统,避免过压损坏;
  • 连续漏极电流(Id):190A(25℃),为持续工作的最大漏极电流,需配合散热设计(如铝基板、散热片)确保结温不超150℃;
  • 脉冲漏极电流:需参考新锐官方datasheet(典型值可支持更高脉冲电流,适合电机启动等场景)。

2. 导通与开关参数

  • 导通电阻(RDS(on)):2.7mΩ@10V、57A,栅压10V属于常规驱动电压,低导通电阻可显著降低导通损耗(损耗公式:P=I²×RDS(on));
  • 栅极电荷(Qg):80nC@20V,是驱动MOSFET所需总电荷量,直接影响驱动电路功率消耗,80nC在同等级器件中处于合理范围,兼容普通驱动IC;
  • 电容参数:Ciss=4.9nF(输入电容,影响输入驱动电流)、Crss=317pF(反向传输电容,影响米勒平台持续时间及开关速度),参数均衡可避免开关过冲。

3. 功率与温度参数

  • 最大耗散功率(Pd):61W(25℃),25℃环境下的最大允许功率损耗,实际应用需根据环境温度降额(如100℃时Pd约30W);
  • 工作结温(Tj):-55℃~+150℃,覆盖低温(车载低温)、高温(工业控制柜)场景,可靠性更高。

三、封装与可靠性设计

XR190N04采用TO-252-3L(DPAK)贴片封装,具备以下优势:

  1. 体积紧凑:封装尺寸约6.5mm×5.0mm×1.5mm,适合小型化电路(如笔记本电池保护板、小型电源模块);
  2. 散热性能:引脚与散热焊盘设计利于漏极热量传导至PCB,配合合理layout可有效降低结温;
  3. 焊接兼容:贴片式设计兼容自动贴装(SMT)工艺,生产效率高;
  4. 可靠性保障:经过温度循环、湿度测试、ESD防护等多轮可靠性测试,符合RoHS环保标准,适合批量应用。

四、典型应用场景

XR190N04的参数特性使其适用于以下场景:

  1. 消费电子:笔记本/平板电脑电池保护板、100W+快充充电器、移动电源升压/降压模块;
  2. 工业电源:DC-DC转换器(12V→5V/3.3V大电流降压)、小功率伺服电机/步进电机H桥驱动、PLC电源模块;
  3. 车载电子:12V车载电源管理、LED大灯驱动(大电流LED阵列)、车载充电器;
  4. 电动工具:电钻、电锤、割草机电机控制模块(大电流启动与持续工作);
  5. 其他:UPS辅助电源、LED显示屏电源驱动。

五、品牌与技术支持

新锐半导体(XNRUSEMI)是国内专注功率半导体研发制造的厂商,XR190N04属于其核心功率MOSFET型号,品牌提供:

  1. 完整datasheet:含详细参数、测试曲线、应用参考设计;
  2. 技术支持:针对电路设计提供驱动优化、散热方案建议;
  3. 质量保障:符合ISO9001体系,批量订单可提供样品测试与小批量试产支持。

总结

XR190N04凭借高电流承载、低导通损耗、宽温可靠性及紧凑封装,成为中低压大电流场景的高性价比选择,可满足消费电子、工业、车载等多领域功率控制需求,是工程师设计高效功率电路的可靠器件。

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