WMSIC Electronic Components

XNRUSEMI XR100N20G

ModelXR100N20G
PackageTO263-7L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR100N20G
Type
XNRUSEMI
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR100N20G
Electronic Component
1
Package
TO263-7L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0264974444
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
272W
Electronic Component
Electronic Component
Electronic Component
800
Voltage(Vdss)
200V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR100N20G 产品概述

一、产品简介

XR100N20G 是 XNRUSEMI(新锐)推出的一款高单元密度沟槽式 N 沟道功率 MOSFET,主要面向大电流同步降压转换器和高效电源应用。该器件在 200V 漏源耐压下提供极低的导通电阻和大电流能力,同时通过 100% 雪崩耐量测试和全功能可靠性认证,适合对可靠性有较高要求的工业与通信场合。

二、关键参数(主要规格)

  • 类型:N 沟道沟槽式 MOSFET
  • 漏源电压 Vdss:200 V
  • 连续漏极电流 Id:100 A
  • 导通电阻 RDS(on):20 mΩ @ Vgs = 10 V
  • 栅极阈值电压 Vgs(th):4 V
  • 总栅极电荷 Qg:134 nC @ 50 V
  • 输入电容 Ciss:8.826 nF
  • 输出电容 Coss:532 pF
  • 反向传输电容 Crss:148 pF
  • 功耗 Pd:272 W
  • 工作温度:-55 ℃ ~ +150 ℃
  • 封装:TO263-7L(大面积散热引脚)
  • 认证:RoHS、绿色产品,100% 雪崩耐量

三、主要特点与优势

  • 低 RDS(on) 与高电流承载:20 mΩ 的低导通电阻在高电流场景下显著降低导通损耗,适合作为低侧同步整流或主开关器件。
  • 高电压余量:200 V 的耐压等级适用于 48V/400V 总线侧或中高压开关电源拓扑。
  • 完整可靠性测试:100% 雪崩耐量与可靠性认证提供更好的容错与长期稳定性。
  • 封装利于散热:TO263-7L 封装便于在大电流应用中通过 PCB 与散热器实现热管理。

四、应用场景

  • 同步降压转换器(高电流输出端)
  • 服务器与通信电源、分布式电源模块
  • 逆变器与电机驱动的低侧开关
  • 离线电源及功率因数校正中的高压开关单元(需配合适当驱动)

五、设计建议与注意事项

  • 栅极驱动:Qg = 134 nC 相对较大,需选用驱动能力充足的栅极驱动器并考虑驱动电流,以控制开关损耗与开关时间。
  • 开关损耗管理:在高频率应用中需权衡导通损耗与开关损耗,必要时降低开关频率或采用软开关/缓冲网络减少应力。
  • 散热设计:Pd 标称值需结合 PCB 铜箔、散热器与器件结到壳温度(Tj、Tc)一起设计,保证在最大工作温度下的安全余量。
  • 并联使用:可并联以降低等效 RDS(on),但需做好散热与电流均衡设计。
  • 防护电路:建议在高压应用中加入合适的 TVS、RC 缓冲或能量回收电路,利用器件的雪崩特性仍要避免反复高能量应力。

六、总结

XR100N20G 以其 200V 耐压、100A 连续电流能力和 20 mΩ 的低导通电阻,适合需要高导通性能与可靠性的同步降压及高电流电源设计。设计时应关注栅极驱动与散热管理,结合器件的电容与栅极电荷特性优化开关策略,以在效率与功率密度间取得最佳平衡。XNRUSEMI(新锐)提供 RoHS 合规与全面可靠性保证,便于在工业级产品中长期部署。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.