WMSIC Electronic Components

XNRUSEMI XR80N07T

ModelXR80N07T
PackageTO-220AB
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR80N07T
Type
XNRUSEMI
Minimum package
50 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR80N07T
Electronic Component
1
Package
TO-220AB
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
2.8g
Electronic Component
1
Electronic Component
BM0264896668
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
136W
Electronic Component
Electronic Component
Electronic Component
50
Voltage(Vdss)
70V
Capacitor(Ciss)
4.723nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR80N07T 产品概述

一、产品简介

XR80N07T 是 XNRUSEMI(新锐)推出的一款高单元密度沟槽式 N 沟道功率 MOSFET,采用 TO-220AB 封装。针对同步降压转换器和中高电流开关应用进行了优化,在导通损耗与开关能力之间取得良好平衡,适合需要高电流承载能力与可靠性的电源管理场景。

二、主要电气参数

  • 类型:N 沟道 MOSFET(沟槽式结构)
  • 漏源电压 Vdss:70 V
  • 连续漏极电流 Id:80 A
  • 导通电阻 RDS(on):5 mΩ @ Vgs = 10 V
  • 最大耗散功率 Pd:136 W
  • 阈值电压 Vgs(th):3 V
  • 总栅极电荷 Qg:76 nC @ 34 V
  • 输入电容 Ciss:4.723 nF
  • 反向传输电容 Crss:207 pF
  • 工作温度范围:-55 °C ~ +150 °C
  • 封装:TO-220AB

三、主要特性与优势

  • 低导通电阻:5 mΩ 的 RDS(on)(在 10 V 驱动下)显著降低导通损耗,适合高电流低压差的开关场合。
  • 强劲电流能力:80 A 连续漏极电流使其在同步整流、功率开关和高性能电源中表现出色。
  • 良好的散热承载:TO-220AB 封装结合 Pd = 136 W 的功耗能力,便于外接散热片以满足热设计需求。
  • 受控开关特性:总栅极电荷 Qg = 76 nC 与 Ciss、Crss 参数综合决定了开关损耗与驱动需求,便于工程师在效率与 EMI 之间进行优化。
  • 抗雪崩与可靠性:产品符合 RoHS 与绿色环保要求,100% 保证雪崩耐量,并通过全功能可靠性认证,适合对可靠性要求较高的应用场景。

四、典型应用场景

  • 同步降压转换器(同步整流与功率开关)
  • 服务器/通信电源、VRM及点对点电源模块
  • 中小功率逆变/UPS 系统与电池管理
  • 电机驱动与工业控制开关电路(在 70 V 限制内)
  • 开关电源、LED 驱动与消费类高性能电源管理模块

五、设计与布局建议

  • 驱动器选择:76 nC 的较大栅极电荷要求配备足够驱动能力的门极驱动器,以降低开/关过渡时间和开关损耗;在高频应用中应评估驱动功耗与热耗散。
  • 板级布局:尽量缩短漏极—源极、大电流回路的走线,采用宽铜皮与多层回流方案以降低寄生阻抗与热阻。
  • 抗干扰:Crss = 207 pF 会影响米勒效应,布线时注意栅—漏寄生电容的耦合,必要时可加米勒电阻或 RC 缓冲网络以抑制振铃与 EMI。
  • 并联使用:若需要更低的等效 RDS(on),可并联多颗器件,但需做好电流均流设计与热均衡,避免因门极驱动不一致导致的不均流。

六、封装与散热

TO-220AB 封装便于通过螺丝安装外接散热片,适合中等功率场合。为充分利用 Pd = 136 W 的耗散能力,建议在实际应用中:

  • 使用合适尺寸的散热片并保证热阻匹配;
  • 在高功率连续工作时评估结温(Tj)并保持在额定范围内;
  • 参考完整数据手册获取 RθJC / RθJA 等热阻参数进行精确热设计。

七、可靠性与合规性

XR80N07T 满足 RoHS 与绿色产品要求;产品通过全功能可靠性认证并保证 100% 雪崩耐量,适合对抗瞬态高压或感性碰撞电流有一定要求的电路设计。在关键应用中仍建议做系统级的过温、短路与冲击测试验证。

八、采购与使用注意事项

  • 型号:XR80N07T,品牌:XNRUSEMI(新锐),封装:TO-220AB。
  • 在选型时请结合系统工作电压、开关频率与热预算,评估门极驱动功率与散热需求。
  • 如需更详细的绝对最大额定值、动态开关波形与热阻参数,请参考完整数据手册或联系厂商技术支持以获得样片与测试数据。

XR80N07T 在中高电流、70 V 等级的同步降压与功率开关应用中提供了低导通损耗与可靠性保证,是追求效率与稳定性的工程设计人员的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.