WMSIC Electronic Components

XNRUSEMI XR60N10H

ModelXR60N10H
PackageTO252-3L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR60N10H
Type
XNRUSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR60N10H
Electronic Component
1
Package
TO252-3L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0264974436
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
154W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR60N10H N沟道功率MOSFET产品概述

XR60N10H是新锐半导体(XNRUSEMI)推出的低压大电流N沟道功率MOSFET,采用TO-252-3L(DPAK)贴片封装,专为100V以下电压平台的开关应用设计,兼顾高电流承载能力与低导通损耗,适用于电动车辅助系统、DC-DC转换器、电池保护等多场景。

一、产品核心定位与应用场景

XR60N10H定位为中低压大电流功率开关器件,核心解决100V以内电压下的连续60A电流驱动需求,可替代同参数传统MOSFET或部分小功率IGBT,典型应用场景包括:

  • 电动车/电动自行车:车灯、喇叭、小型辅助电机(座椅调节、门锁)驱动;
  • 电源系统:48V→12V/24V DC-DC降压转换器(大电流输出端);
  • 电池管理:多串锂电池组(≤100V)充放电保护开关;
  • 照明领域:大功率LED路灯、工矿灯驱动电路;
  • 工业控制:小型伺服电机、步进电机低压驱动模块。

二、关键电气性能参数解析

XR60N10H的参数围绕“低损耗、高电流、宽温”设计,核心参数的实际意义如下:

1. 电压与电流能力

  • 漏源击穿电压(Vdss):100V:保证100V以内电路不会过压击穿,实际应用建议≤80V(留20%安全裕量);
  • 连续漏极电流(Id):60A:常温下稳定承载60A连续电流,脉冲电流能力(典型值120A-180A)满足瞬间大电流需求;
  • 耗散功率(Pd):154W:基于TO-252封装散热能力,60A时导通损耗仅72W(I²R=60²×0.02),留有充足余量。

2. 导通与开关特性

  • 导通电阻(RDS(on)):20mΩ@10V:核心优势——比同参数竞品低10%-15%,直接降低导通损耗,提升系统效率;
  • 阈值电压(Vgs(th)):4V@250uA:与3.3V/5V驱动IC电平匹配,无需电平转换,简化驱动电路;
  • 栅极电荷量(Qg):87nC@10V:适中电荷平衡开关速度与驱动功率,适合100kHz以下开关频率(电源/电机驱动典型频率)。

3. 电容与耐温特性

  • 输入电容(Ciss):6.249nF、反向传输电容(Crss):196pF:Crss较低减少米勒效应,提升开关稳定性;
  • 工作温度范围:-55℃~+150℃:覆盖工业级/汽车级温度需求,适应极端环境(高温车间、低温户外)。

三、封装与可靠性设计

XR60N10H采用TO-252-3L贴片封装,设计优势包括:

  • 体积紧凑:6.5mm×4.4mm尺寸,适合高密度PCB布局;
  • 散热高效:引脚与散热片一体化,可通过PCB铜箔/散热片快速导温;
  • 可靠性强:符合RoHS标准,引脚抗氧化处理,支持260℃回流焊,抗机械应力。

四、选型优势总结

对比同参数(100V/60A)竞品,XR60N10H核心优势:

  1. 低损耗:20mΩ RDS(on)提升效率5%-8%;
  2. 宽温可靠:-55℃~+150℃,比部分竞品高20℃;
  3. 驱动简单:4V阈值兼容常见驱动IC;
  4. 性价比高:新锐半导体量产稳定性强,适合中大规模应用。

XR60N10H在导通损耗、电流能力与可靠性上实现平衡,是电动车、电源、工业控制等领域的高性价比选择。

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