WMSIC Electronic Components

XNRUSEMI XR40N06D

ModelXR40N06D
PackagePDFN3333-8L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR40N06D
Type
XNRUSEMI
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR40N06D
Electronic Component
1
Package
PDFN3333-8L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.18g
Electronic Component
1
Electronic Component
BM0264974401
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
37.7W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR40N06D N沟道MOSFET产品概述

一、核心参数解析

XR40N06D是一款针对中低压大电流场景优化的N沟道MOSFET,核心参数具备以下关键特性:

  • 电压电流规格:60V漏源击穿电压(Vdss)覆盖12V/24V系统的安全余量,连续漏极电流(Id)达40A,可稳定驱动中等功率负载;
  • 导通损耗控制:10V栅源电压下导通电阻(RDS(on))仅17mΩ,属于同等级产品中较低水平,能显著降低导通时的功率损耗,提升系统效率;
  • 开关特性:50nC栅极电荷量(Qg)平衡了开关速度与驱动难度,2.9nF输入电容(Ciss)和120pF反向传输电容(Crss)减少了开关噪声与损耗,适配100kHz以内的高频应用;
  • 阈值与功率:250uA漏极电流下阈值电压(Vgs(th))为2.5V,兼容常见MCU/驱动IC的输出电平(如3.3V/5V),无需额外电平转换;37.7W最大耗散功率(Pd)满足持续工作的热预算。

二、封装与散热特性

采用PDFN-8L(3.3×3.3mm) 小封装,相比传统TO-252(DPAK)封装,占板面积减少约60%,适合高密度PCB设计;
8引脚设计中,漏极与封装底部金属焊盘直接连接,可通过PCB铜箔快速散热,降低热阻(典型值约1.3℃/W),提升长期工作稳定性;
无铅无卤封装符合RoHS环保要求,适配现代电子制造的回流焊工艺。

三、典型应用场景

XR40N06D的参数特性适配多领域需求:

  1. 车载电子:-55℃~+175℃宽温范围适配发动机舱、仪表盘等极端环境,40A电流支持车载DC-DC转换器(12V转5V/3.3V)、电动座椅/后视镜电机驱动、BMS充放电回路;
  2. 工业电源:60V耐压满足工业设备12V/24V系统,低导通损耗提升电源转换效率,适合PLC电源、伺服驱动器电源模块;
  3. 消费电子:小封装适配笔记本电脑、平板电脑的快充模块,40A电流支持65W PD快充等高功率场景;
  4. 电机驱动:低RDS(on)减少电机驱动时的热损耗,适合小型直流电机、无刷电机(BLDC)的低功率驱动。

四、性能优势与设计价值

  • 效率平衡:低RDS(on)与适中Qg实现“导通损耗+开关损耗”的最优平衡,尤其适合10W~100W功率范围的系统;
  • 设计灵活性:宽温范围、兼容驱动电平(2.5V阈值)降低了系统设计难度,无需额外增加散热片即可满足多数场景的热需求;
  • 小型化优势:PDFN-8L封装支持产品轻薄化,符合消费电子、车载电子的小型化趋势;
  • 可靠性保障:新锐半导体(XNRUSEMI)的工艺保障,通过温度循环(-55℃~175℃,1000次)、湿度老化(85℃/85%RH,1000h)等可靠性测试,适合长期稳定工作。

五、总结

XR40N06D是一款性价比突出的中低压大电流MOSFET,凭借低导通电阻、宽温范围、小封装等优势,广泛适配车载、工业、消费电子等领域,为系统设计提供高效、可靠的功率开关解决方案,是替代传统TO封装器件的理想选择。

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