Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XNRUSEMI XR10N10
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR10N10
- Type
- XNRUSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR10N10
- Electronic Component
- 1
- Package
- TO-252-3L
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0264974386
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 34.7W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage(Vdss)
- 100V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR10N10 产品概述
一、规格亮点
XR10N10 是一款高单元密度的沟槽式 N 沟道 MOSFET（封装：TO-252-3L），面向大多数同步降压和开关功率应用。主要电气参数如下：
- 漏源耐压 Vdss：100 V
- 连续漏极电流 Id：10 A
- 导通电阻 RDS(on)：150 mΩ @ Vgs = 10 V
- 最大耗散功率 Pd：34.7 W
- 阈值电压 Vgs(th)：2.5 V
- 总栅极电荷 Qg：26.2 nC（测试点 VDS = 80 V）
- 输入电容 Ciss：1.023 nF；反向传输电容 Crss：25 pF
- 工作温度范围：-55 ℃ ~ +150 ℃
- 特性：100% 雪崩能量（EAS）保证，RoHS/绿色合规
二、主要特性与性能解读
XR10N10 采用沟槽栅结构与高单元密度设计，在保持较低导通电阻的同时维持良好的开关特性。RDS(on) 标注在 Vgs=10 V 条件下适合使用典型的驱动电压（例如高侧/低侧驱动器或 10–12 V 门极驱动）。阈值电压约 2.5 V，仅作为导通起始参考，不能保证在 5 V 或更低栅压下达到额定 RDS(on)。
栅极电荷 Qg=26.2 nC 表明在高频开关时需使用驱动器提供较大脉冲电流以缩短上、关时间，平衡开关损耗与 EMI。较小的 Crss 有利于降低米勒效应引起的误触发和开关过渡能量。
三、典型应用场景
- 同步降压（buck）转换器的高/低侧 MOSFET
- 中小功率 DC-DC 电源模块与点对点转换
- 电池管理与电源路径控制
- 电机驱动及功率开关单元（在额定电流与散热允许范围内）
- 通用开关与保护电路
四、设计与布局建议
- 栅极驱动：为达到标称 RDS(on)，建议采用 10 V 驱动；驱动器需能提供足够的峰值电流以快速充放 Qg，必要时增加合适阻尼（门极电阻）以控制 dv/dt 与 EMI。
- 热管理：TO-252-3L 的热阻受 PCB 铜面积与散热条件影响明显。34.7 W 的 Pd 通常在理想散热条件（例如大面积散热铜/散热片或良好空气流通）下才可实现，请根据实际 PCB 热阻计算结温并留足裕量。
- 布局：尽量缩短源、漏、栅的回流路径，减小寄生电感；功率回路使用宽铜箔、靠近封装焊盘布线；关断瞬态处考虑 RC 或 RC+TVS 抑制过冲。
- 驱动/开关频率：在高频下需权衡导通损耗与开关损耗，考虑并联器件或采用更低 RDS(on) 的 MOSFET 以减小总体损耗。
五、可靠性与合规
XR10N10 提供 100% 雪崩能量（EAS）测试保证，适合有被动过冲或短时能量承受需求的应用。产品符合 RoHS 与绿色环保要求。实际设计中建议参考完整数据手册的 SOA、热阻和绝对最大额定值，进行仿真与样机验证以确保长期可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
