WMSIC Electronic Components

XNRUSEMI XR15N04S

ModelXR15N04S
PackageSOP8
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR15N04S
Type
XNRUSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR15N04S
Electronic Component
1
Package
SOP8
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.173g
Electronic Component
1
Electronic Component
BM0264974383
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
3W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR15N04S N沟道MOSFET产品概述

一、基本信息与品牌定位

XR15N04S是新锐半导体(XNRUSEMI) 推出的一款N沟道增强型MOSFET,采用SOP-8标准贴片封装,体积紧凑(约5mm×6mm),便于自动化贴装,核心定位为低压中小功率场景的功率控制器件。新锐半导体作为国内功率器件领域的专业厂商,该产品主打“高性价比+宽适配性”,可替代部分进口同类产品。

二、核心参数与性能优势

1. 电压电流承载能力

  • 漏源击穿电压(Vdss):40V,覆盖12V/24V等常见低压直流系统(如车载、电池供电设备)的工作电压范围,满足一般低压电路的耐压需求;
  • 连续漏极电流(Id):15A,可稳定驱动小型直流电机、大功率LED等中等负载;脉冲电流(典型值30A@10ms)支持短时间过载,适配电机启动等瞬时大电流场景。

2. 低导通损耗设计

在Vgs=10V(典型驱动电压)下,导通电阻(RDS(on))仅14mΩ,属于同类产品中的低阻水平。低导通电阻直接降低导通功率损耗(公式:P=I²×RDS(on)),例如:

  • 当负载电流为10A时,导通损耗仅1.4W,远低于20mΩ级器件的2W损耗;
  • 对电池供电设备(如便携式电源)而言,可有效延长续航时间,减少散热压力。

3. 开关特性与驱动兼容性

  • 栅极总电荷量(Qg):16nC(Vgs=4.5V时),驱动电流需求低,3.3V/5V单片机可直接驱动,无需额外升压电路;
  • 输入电容(Ciss=1.639nF)、反向传输电容(Crss=122pF)参数合理,开关速度适中(典型t_on≈10ns,t_off≈15ns),可满足高频DC-DC转换、快速负载切换等场景。

4. 宽温与可靠性

  • 工作温度范围:-55℃~+150℃,符合工业级器件要求,可在高低温环境下稳定工作(如户外传感器、车载控制模块);
  • 阈值电压(Vgs(th)):2.5V(Id=250uA时),阈值适中——既避免低阈值器件易受干扰误触发的问题,又保证低电压驱动的兼容性。

三、典型应用场景

XR15N04S的参数特性使其在多个领域具备优势:

  1. 低压电机驱动:12V/24V小型直流电机(扫地机器人、小型水泵)的正反转控制;
  2. 电源管理:DC-DC降压转换器(12V转5V)的同步整流管,提升转换效率;
  3. 负载开关:电池保护电路、电源通断模块,实现低损耗负载通断;
  4. 小型逆变器:12V转220V小功率逆变器的开关管;
  5. 工业控制:PLC输入输出模块、传感器驱动电路,适配工业现场宽温环境。

四、封装与环保特性

SOP-8封装为标准贴片形式,散热路径清晰(通过引脚+PCB铜箔散热),结合3W最大耗散功率,无需额外散热片即可满足多数应用;产品符合RoHS环保标准,无铅无卤,适配现代电子设计的环保要求。

总结

XR15N04S以低导通电阻、宽温范围、易驱动为核心优势,精准匹配低压中小功率电子系统的需求,是替代进口同类产品的高性价比选择,适用于消费电子、工业控制、电源管理等多个领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.