Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XHSC HC32L130E8PA-TSSOP28 HC32L130E8PA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XHSC HC32L130E8PA-TSSOP28
- Type
- XHSC
- Minimum package
- 3840 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XHSC
- Electronic Component
- HC32L130E8PA-TSSOP28
- Electronic Component
- 1
- Package
- TSSOP-28
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 3.421g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M0+
- I / O
- 23
- RAM
- 8KB
- Electronic Component
- 1
- ADC
- 12bit
- DAC
- 6bit
- Electronic Component
- BM0230027603
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HC32L130E8PA-TSSOP28 产品概述
一、产品简介
HC32L130E8PA-TSSOP28 是 XHSC（小华）面向中低端嵌入式控制的单片机产品，基于 ARM Cortex-M0+ 内核设计，主频最高可达 48MHz。器件集成 64KB Flash 程序存储、8KB SRAM，提供 23 路通用 I/O 和 12 位 ADC，工作电压范围宽（1.8V ~ 5.5V），以 TSSOP-28 封装形式提供，适合尺寸受限但功能要求较为全面的控制方案。
二、核心参数一览
- CPU：ARM Cortex-M0+，最高 48MHz
- 存储：64KB Flash（程序存储），8KB SRAM（数据）
- I/O：23 路通用 I/O（GPIO）
- ADC：12-bit 分辨率，适用于中精度模拟量采集
- 电源：工作电压 1.8V ~ 5.5V，适配多种电源方案
- 封装：TSSOP-28，利于中小批量手工焊接与自动贴片
三、功耗与工作特性
器件基于 Cortex-M0+ 低功耗架构，适合对能耗敏感的应用。宽电压输入允许直接与常见电池、DC-DC 或线性稳压器配合使用，降低系统外围设计复杂度。常见低功耗运行模式可满足睡眠、待机等场景的电流控制需求（具体电流值请参照详细数据手册）。
四、外设与接口（典型）
HC32L130E8PA 面向通用控制市场，通常配置满足常见外设需求，包括但不限于：
- 多路定时器/计数器，支持 PWM、事件计时等
- 串行通信接口（UART/USART）、SPI、I²C 等，方便与传感器、显示及外设连接
- 硬件看门狗、系统定时器等安全与复位机制
- 12-bit ADC 用于模拟信号采集和传感器读数
（具体可用外设和通道分配请参考芯片引脚与功能表）
五、封装与系统集成
TSSOP-28 封装在体积与焊接便利性之间取得平衡，适合 PCB 面积受限的消费电子、工业控制及家电产品。23 根 I/O 和多功能引脚支持灵活的管脚复用与外设扩展，有利于简化 PCB 布局并降低 BOM 成本。
六、典型应用场景
- 电池供电类便携设备与传感终端
- 工业控制与仪表（中低速采样和控制）
- 家用电器控制板、照明与驱动控制
- 智能传感模块、人机界面（按键、指示灯）等
七、开发与生态支持
HC32L130E8PA 与 ARM Cortex-M0+ 生态兼容，支持主流编译器与调试工具链（如 Keil MDK、GCC、IAR 等）以及常见的调试接口和下载方式。XHSC 通常提供配套的数据手册、引脚图、示例代码与参考设计，便于快速导入工程与缩短产品上市周期。
总结：HC32L130E8PA-TSSOP28 在有限封装下提供了均衡的计算能力、存储与模拟采集能力，适合对成本、功耗和尺寸有综合考量的嵌入式应用。具体性能参数和外设细节请以厂商最新数据手册为准。
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