Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XHSC HC32L196PCTA-LQFP100 HC32L196PCTA
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- XHSC HC32L196PCTA-LQFP100
- Type
- XHSC
- Minimum package
- 900 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XHSC
- Electronic Component
- HC32L196PCTA-LQFP100
- Electronic Component
- 1
- Package
- LQFP-100(14x14)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0g
- CPU
- ARM Cortex-M0
- Electronic Component
- 1
- Electronic Component
- BM0230038948
- CPU
- 48MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 900
- Electronic Component
- 256KB
- Memory Type
- FLASH
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HC32L196PCTA-LQFP100 产品概述
一、产品简介
HC32L196PCTA-LQFP100 是 XHSC（小华）推出的一款基于 ARM Cortex‑M0 内核的 32 位单片机（MCU）。芯片最高主频可达 48MHz，片内 Flash 程序存储容量为 256KB，片上 SRAM 为 32KB，提供多达 88 路可用 I/O。器件内置 12‑bit ADC 与 12‑bit DAC，工作电压范围宽至 1.8V ～ 5.5V，适配电池供电与工业供电场景。封装为 LQFP‑100（14×14mm），便于高密度引脚布线与散热。
二、主要性能亮点
- 处理能力：ARM Cortex‑M0 核心，最高 48MHz，适合实时控制与中低复杂度算法执行。
- 存储资源：256KB FLASH 用于程序存储，32KB SRAM 支持运行时数据与缓冲需求。
- I/O 与模拟能力：88 路 I/O 提供优秀的外设扩展能力；片内 12‑bit ADC/DAC 满足高精度模拟信号采集与输出。
- 电源适应性：1.8V～5.5V 的宽电压工作范围，适合多种供电方案（包括单节锂电、3.3V/5V 系统及部分工业总线电源）。
- 封装与布局：LQFP‑100（14×14mm）封装在保证引脚数量的同时，有利于散热和 PCB 布局。
三、片上外设与系统集成价值
HC32L196PCTA 在保持 Cortex‑M0 简洁高效的同时，提供高精度模数/数模转换能力以及充足的数字 I/O，使其在传感器采集、模拟控制、PWM 输出与多路开关量处理方面具有明显优势。88 路 I/O 能够直接驱动大量外设或通过外部扩展芯片实现总线型拓展，适合中大型控制面板、数据采集仪及网关类产品。其宽电压特性提高了系统抗干扰与适配多电源环境的能力。
四、典型应用场景
- 工业控制与自动化：PLC 辅助控制、运动控制子模块、工业检测仪表。
- 仪器仪表与数据采集：多通道传感器采集、便携式测试设备、医疗检测前端。
- 消费电子与家电：智能家居控制面板、家电控制单元、可穿戴与便携产品。
- 能源与测量：电池管理子系统、能量采集控制、环境监测节点。
五、设计与选型建议
在系统设计时建议充分利用器件的宽电压特性，做好电源去耦与模拟地布局以保证 ADC/DAC 精度。LQFP‑100 封装在 PCB 走线时要考虑散热与信号完整性；若空间受限，可评估其他封装或模块化方案。开发调试方面，可采用常见的 Cortex‑M0 生态工具链（如 Keil、GCC 与常见调试器）进行固件开发与在线调试。选型时请根据 I/O、模拟通道数量及系统资源（存储、实时性）匹配最终硬件方案。
如需进一步的器件电气参数表、引脚分配或参考设计资料，可联系 XHSC（小华）或相关授权代理获取详细数据手册与评估板信息。
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