Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
O9503225MEDA4SI 是扬兴科技(YXC)旗下 YSO690PR 系列的 25.000MHz 表贴晶振,工作电压 3.3V,输出为 CMOS 电平。该器件以小型 SMD5032-4P 封装、高稳定度与工业级温度范围为设计目标,适用于对时钟精度与可靠性有较高要求的嵌入式与通信系统。
SMD5032-4P 为标准 4 引脚贴片晶振封装,体积小、厚度薄,利于面装生产与高密度布局。常见引脚安排包含 VCC、GND、OUT 与 NC/EN,实际引脚定义及焊盘推荐尺寸请以厂家 Datasheet 为准。封装有利于焊接可靠性与散热性能,适合自动回流焊工艺。
YSO690PR 系列通过严格的温度循环、振动/冲击与老化测试,适用于工业级应用。出厂前进行频率筛选与标称频差校准;长期使用中,建议关注晶振老化特性并在系统中预留校正方案(如软件补偿或外部参考)。
器件型号:O9503225MEDA4SI(YSO690PR 25MHz 3.3V CMOS SMD5032-4P)。采购时请向厂家或授权分销商索取最新 Datasheet、封装建议与样片以便在设计初期验证相容性与性能。扬兴科技提供量产支持、可靠性数据与应用咨询,可根据项目需求协助定制测试项或出货规格。
总结:O9503225MEDA4SI 以 25MHz、3.3V CMOS 输出、工业级温度范围与小型 SMD5032-4P 封装为特点,适合对时钟精度、稳定性与空间密度有要求的多种电子系统。选择与布局时遵循去耦、短线与接地原则可确保最佳性能。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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