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YLPTEC ISO3088-Y ISO3088
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- YLPTEC ISO3088-Y
- Type
- YLPTEC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- YLPTEC
- Electronic Component
- ISO3088-Y
- Electronic Component
- 1
- Package
- SOIC-16W
- Electronic Component
- Isolated RS485 / 422Transceiver
- Electronic Component
- 0.873g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0265023097
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ISO3088-Y 产品概述
一、产品简介
ISO3088-Y 是 YLPTEC（易川）推出的一款高速半双工隔离 RS-485 收发器，采用电容隔离技术并封装于 SOIC-16W（SOP16 宽体）封装。器件将串行差分通信接口与隔离接口结合，提供总线失效保护电路，适用于工业现场总线和恶劣电磁环境下的可靠数据传输需求。
二、主要功能与特性
- 支持半双工差分 RS-485 通信，适合多节点总线拓扑。
- 电容隔离实现信号隔离与地隔离，便于系统两侧独立接地与安全设计。
- 集成失效保护电路（failsafe），在总线空闲、开路或短路情况下保持确定的接收端逻辑电平，降低系统异常风险。
- SOP16 宽体封装，便于在常规 PCB 工艺中布局与散热。
- 针对工业应用优化，具备抗干扰能力和可靠性设计，便于在电磁噪声较大的环境中稳定工作。
三、引脚与封装要点
ISO3088-Y 采用 SOIC-16W（宽体）封装，常见引脚包括供电与地、差分 A/B 接口、数据输入/输出、驱动/接收使能等控制引脚，以及隔离侧的电源与地引出。封装宽体设计有利于隔离间距和 PCB 走线布局。
四、典型应用场景
- 工业自动化通信总线（PLC、现场总线网关）
- 楼宇控制与安防系统中的远端设备通信
- 仪器仪表数据采集与远距离传输
- 电力监测、能源管理与智能表计接口
五、设计与使用建议
- 布局时注意隔离区的爬电距离与防污设计，遵循厂商推荐的走线分割与旁路电容布置。
- 总线端应按需要配置终端电阻与防反射措施，并避开长分支线。
- 在高共模干扰场合，配合差分滤波与共模抑制器件可提升可靠性。
- 依据系统要求选择合适的隔离等级与外部保护器件以满足安全规范。
六、产品优势总结
ISO3088-Y 将高速差分通信、可靠的失效保护与电容隔离技术集成于紧凑封装，便于在工业级应用中替代传统分立隔离方案，降低系统设计复杂度并提升抗干扰与安全性，是需要隔离保护与高可靠性的 RS-485 通信方案的优选器件。
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