WMSIC Electronic Components

YLPTEC CTM1051AMG

ModelCTM1051AMG
PackageDIP-7
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC CTM1051AMG
Type
YLPTEC
Minimum package
39 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
CTM1051AMG
Electronic Component
1
Package
DIP-7
Electronic Component
Other Module
Electronic Component
2.603g
Electronic Component
1
Features
CAN FD
Electronic Component
BM0258684544
Operating Voltage
3.15V~3.45V
Data
5Mbps
Isolation
Isolated
Output Interface
CANInterface
Static Current(Iq)
10mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CTM1051AMG 产品概述

一、产品概况
CTM1051AMG(品牌:YLPTEC/易川)是一款带隔离的高性能CAN总线接口器件,采用DIP-7封装,专为需要可靠电气隔离和高速数据传输的嵌入式与工业控制系统设计。描述:校验通过!

二、主要特点

  • 输出接口:CAN接口,支持差分总线通信;
  • 数据速率:最高5 Mbps,满足大多数高速CAN通信需求;
  • 隔离:带隔离,提供良好的共模抑制与地环路隔离能力;
  • 工作电压:3.15 V ~ 3.45 V(典型3.3 V);
  • 静态电流(Iq):约10 mA,低功耗设计;
  • 封装:DIP-7,便于手工焊接与原型开发。

三、性能亮点
CTM1051AMG在保持低静态电流的同时提供较高传输速率,适合对通信稳定性与抗干扰能力有较高要求的场合。带隔离设计可保护主控侧与现场侧之间的电气安全,降低因地电位差或浪涌造成的故障风险。

四、典型应用场景

  • 工业自动化现场总线连接;
  • 工控机与PLC间的CAN通信;
  • 机器人与运动控制系统;
  • 数据采集与传感器网络;
  • 电力、轨道交通等需要隔离保护的通信链路。

五、封装与布局建议
DIP-7封装便于面包板调试与插件式电路板应用。布板时建议在VCC旁配备适当的去耦电容(例如0.1 µF与1 µF并联),CAN差分线对应做对称布线并在两端添加120 Ω终端电阻以保证信号完整性。隔离等级与瞬态抑制元件(TVS)建议根据系统环境选配。

六、使用注意事项

  • 供电须严格控制在3.15–3.45 V范围内;
  • 建议在总线两端使用标准终端电阻并做好共模滤波;
  • 若用于CAN FD或更高带宽场景,请依据实际链路条件验证误码率与兼容性;
  • 关注器件的隔离耐压与工作温度限值(具体参数请参阅厂商规格书)。

七、总结
CTM1051AMG凭借3.3 V供电、小功耗、5 Mbps速率以及带隔离特性,适合希望在复杂电磁环境中实现可靠CAN通信的应用。DIP-7封装利于开发与小批量生产,是原型验证与教育、工业控制领域的实用选择。有关详细引脚定义、时序与电气特性,请参考YLPTEC官方规格书以获得完整设计资料。

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