WMSIC Electronic Components

YLPTEC A0509S-1WR3 A0509S

ModelA0509S-1WR3
PackageSIP
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC A0509S-1WR3
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
A0509S-1WR3
Electronic Component
1
Electronic Component
6mm
Package
SIP
Electronic Component
Isolated Power Supply Module
Electronic Component
3.052g
Electronic Component
19.5mm
Electronic Component
10mm
Electronic Component
1
Electronic Component
BM0258715873
Operating Temperature
40℃~+85℃
Switching Frequency
100kHz
Electronic Component
30mVp-p
Conversion
89%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A0509S-1WR3 产品概述

一、产品简介

A0509S-1WR3 是 YLPTEC(易川)推出的一款高性能双路隔离DC-DC微功率模块。输入电压范围宽(4.5V~5.5V),输出为对称双路 ±9V,总输出功率为1W,转换效率高达89%。模块采用SIP封装,体积小巧(19.5mm × 6mm × 10mm),适合空间受限的嵌入式和工业控制场景。

二、主要规格参数

  • 输入电压(Vin):4.5V ~ 5.5V
  • 输出电压(Vout):±9V(双输出)
  • 输出功率:1W(总功率)
  • 输出电流(最大):56mA(主路);6mA(次路)
  • 转换效率:最高约89%(典型值)
  • 最大容性负载:560 μF
  • 隔离电压(Vrms):1.5 kV
  • 开关频率:100 kHz
  • 静态电流(无负载):5 mA
  • 纹波噪声:30 mV p-p(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸(L×W×H):19.5 × 6 × 10 mm
  • 封装:SIP

三、保护与可靠性

模块内置短路保护、自动故障恢复与过热保护功能,能在出现异常时自动限制输出并在条件恢复后自动复位,提升系统整体可靠性。1.5 kV 的输入输出隔离有利于抑制干扰、保护敏感电路及实现信号隔离。

四、安装与使用建议

  • 输入侧建议靠近模块焊接端添加10 μF~47 μF的低ESR电解或固态电容与0.1 μF的旁路陶瓷,抑制输入纹波与瞬态。
  • 输出侧允许最大容性负载为560 μF,建议使用低ESR电容并避免超出该值以免影响稳态与动态响应。
  • 布局上保持短而粗的电源引线,避免将高频开关走线与敏感模拟信号并行,以降低耦合噪声。
  • 工作环境高温时,应考虑适当散热或降额使用以延长寿命并保证稳定输出。

五、典型应用场景

  • 工业控制信号隔离供电(传感器、隔离放大器)
  • 通信接口供电(隔离型RS-485/RS-232前端)
  • 仪器仪表、测试测量设备的参考及辅助电源
  • 便携式/嵌入式系统中需小功率隔离的场合

六、选型要点与注意事项

  • 若系统对隔离电压或漏电限值有更高要求,请确认是否满足具体标准(如医疗或高压隔离应用可能需更高隔离等级)。
  • 输出电流分配需符合模块给定的56mA/6mA极限,避免长期满载以防温升和寿命降低。
  • 对纹波敏感的模拟电路,应在输出端增加额外滤波并注意接地策略。

七、外形与品牌信息

品牌:YLPTEC(易川);封装形式:SIP;小型化设计便于自动化贴装和波峰/回流焊接整合。A0509S-1WR3 在小体积下实现了高效率与完善保护,适合多种需要隔离且空间受限的电源场合。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.