WMSIC Electronic Components

YLPTEC MGJ2D051802SC

ModelMGJ2D051802SC
PackageSIP-5
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC MGJ2D051802SC
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
MGJ2D051802SC
Electronic Component
1
Electronic Component
9.8mm
Package
SIP-5
Type
Electronic Component
Electronic Component
Isolated Power Supply Module
Electronic Component
5.17g
Electronic Component
19.5mm
Electronic Component
12.5mm
Electronic Component
1
Electronic Component
BM0264518736
Operating Temperature
40℃~+105℃
Switching Frequency
100kHz
Electronic Component
100mVp-p

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MGJ2D051802SC 产品概述

一、产品简介

MGJ2D051802SC 属于 YLPTEC(易川) MGJ2 系列,专为 IGBT 驱动器而优化的双路塑封型 DC-DC 模块。模块采用非对称输出拓扑(+18V / -2.5V),以尽量降低 IGBT 驱动损耗,内部集成输出短路保护并具备自动故障恢复功能。封装为 SIP-5,体积小巧、便于板上直插安装,是高可靠性电力电子系统的理想电源模块。

二、主要电气性能

  • 输入电压(Vin):4.5V ~ 5.5V
  • 输出通道数:2(+18V、-2.5V)
  • 输出电流(最大):80mA(每路)
  • 转换效率:典型 90%
  • 最大容性负载:220μF
  • 隔离电压(Vrms):3kV
  • 开关频率:100kHz
  • 输出纹波噪声:100mVp-p
  • 功能特性:输出短路保护、自动恢复

三、机械与环境特性

  • 封装:SIP-5(塑封型)
  • 尺寸:长度 19.5mm × 宽度 9.8mm × 高度 12.5mm
  • 工作温度范围:-40℃ ~ +105℃
  • 适合板上直插及紧凑型电源布局

四、典型应用

  • 通用变频器的 IGBT 驱动电源
  • 交流伺服驱动系统
  • 电焊机控制单元
  • 不间断电源(UPS)及其它功率电子控制模块

五、设计与使用建议

  • 为保证稳定性,在输入端靠近模块引脚处布置低等效串联电阻(ESR)输入旁路电容;模块允许的最大容性负载为 220μF,超限可能影响稳定性与恢复行为。
  • 输出负载应避免长期接近额定最大电流,以延长可靠性;在高温环境下对输出能力进行适当降额。
  • 版图布线时注意隔离区与爬电距离,隔离耐压 3kVrms 需配合 PCB 绝缘与安装方式实现安全隔离。
  • 虽具短路自动恢复功能,但频繁短路会增加热应力,建议在系统层面加入过流检测与故障上报机制。
  • 对于易受干扰的驱动信号,建议将功率回路与弱信号回路分离,合理安排接地,减小纹波对驱动精度的影响。

MGJ2D051802SC 以其针对 IGBT 驱动优化的非对称输出、较高转换效率与 3kV 隔离能力,适用于对体积、可靠性和驱动损耗有较高要求的工业电力电子场景。

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