WMSIC Electronic Components

YLPTEC B2405M-2WR3 B2405M

ModelB2405M-2WR3
PackageSIP,11.5x7.5mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B2405M-2WR3
Type
YLPTEC
Minimum package
43 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B2405M-2WR3
Electronic Component
1
Electronic Component
7.5mm
Package
SIP,11.5x7.5mm
Electronic Component
Isolated Power Supply Module
Electronic Component
2.163g
Electronic Component
11.5mm
Electronic Component
10mm
Electronic Component
1
Electronic Component
BM0265023169
Operating Temperature
40℃~+105℃
Switching Frequency
100kHz
Electronic Component
30mVp-p
Conversion
88%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B2405M-2WR3 产品概述

一、产品简介

B2405M-2WR3 是 YLPTEC(易川) 出品的微功率隔离型 DC-DC 模块,属于 B_M-2WR3 系列。模块体积小巧(SIP 封装,11.5×7.5×10 mm),输出单路定电压 5V,输出功率 2W,最高输出电流 400mA。该器件专为板上电源系统中需要与输入电源隔离的场合设计,具有高转换效率(典型 88%)、高隔离强度(1.5 kV RMS)与完善的保护功能,适合数字电路、低频模拟、继电器驱动与数据交换等应用。

二、主要规格参数

  • 输入电压(Vin):21.6V ~ 26.4V(适用于输入电压变化±10% 的场合)
  • 输出电压(Vout):5.0V 定电压输出
  • 输出功率:2W,最大输出电流 400mA
  • 转换效率:典型 88%
  • 隔离电压(Vrms):1500V
  • 最大容性负载:2400 µF
  • 开关频率:100 kHz
  • 纹波噪声:30 mV p-p(典型)
  • 工作温度:-40 ℃ ~ +105 ℃
  • 外形尺寸:11.5 mm × 7.5 mm × 10 mm(SIP 封装)

三、功能与保护特性

  • 短路保护:支持短路及过流保护,保证异常工况下对负载和模块本体的保护。
  • 自动故障恢复:故障消除后模块可自动恢复工作,无需外部干预。
  • 过热保护:内置温度保护机制,避免过温损伤。
  • 输出稳压性能优良,适用于对纹波与稳定性要求较高的电路。

四、典型应用场景

  • 板级隔离电源,为逻辑电平隔离、通信接口、数据采集模块提供稳定 5V 电源;
  • 纯数字电路及低频模拟电路供电;
  • 继电器驱动、继电器隔离及小功率执行器供电;
  • 数据交换、接口隔离、微控制器周边供电。

五、设计与使用注意事项

  • 输入电压应保持在 21.6V~26.4V 范围内,典型设计应预留足够裕量以满足 ±10% 变化要求。
  • 输出侧允许的最大容性负载为 2400 µF,若负载含大电容或启动冲击较大,应评估启动浪涌与稳态稳定性。
  • 为保证低纹波与稳定性,建议在模块输入端和输出端增加低 ESR 去耦电容,并尽量将耦合电容布局靠近模块引脚。
  • 模块开关频率 100 kHz,布线时注意减小输入输出回路面积,避免对周围敏感电路产生干扰。
  • 在高温或高负载工况下注意散热管理,确保工作温度在 -40 ℃~+105 ℃ 允许范围内。
  • 需要高可靠性的系统可进行隔离耐压及环境应力验证,以满足最终产品规范。

六、总结

B2405M-2WR3 以其小尺寸、高效率和高隔离性能,适合在要求输入输出隔离且对输出稳定性和纹波噪声有较高要求的板级电源设计中使用。完善的保护功能和自动恢复能力提高了系统可靠性,是继电器驱动、数字模块隔离供电及数据交换等应用的理想选择。若需进一步器件详图、引脚定义或参考电路,请联系 YLPTEC(易川) 技术支持获取详细资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.