WMSIC Electronic Components

YLPTEC QA123-1509R3 QA123

ModelQA123-1509R3
PackageSIP,19.5x9.8mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC QA123-1509R3
Type
YLPTEC
Minimum package
25 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
QA123-1509R3
Electronic Component
1
Electronic Component
9.8mm
Package
SIP,19.5x9.8mm
Electronic Component
Isolated Power Supply Module
Electronic Component
5.13g
Electronic Component
19.5mm
Electronic Component
12.5mm
Electronic Component
1
Electronic Component
BM0264771698
Operating Temperature
40℃~+105℃
Switching Frequency
200kHz
Electronic Component
100mVp-p
Conversion
82%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

QA123-1509R3 产品概述

一、产品简介

QA123-1509R3 是 YLPTEC(易川) QAxx3-R3 系列中专为 IGBT 驱动器设计的双路隔离式 DC-DC 模块。模块采用非对称输出设计(+15V / -8.7V),旨在降低 IGBT 驱动损耗并提高开关效率。该模块输入工作电压为 4.5V ~ 5.5V,输出稳定、噪声低,且具备输出短路保护与自动故障恢复功能,适合在工业电力电子场合长期可靠工作。

二、主要性能参数

  • 输出通道:2 路(非对称输出)
  • 输出电压:+15V、-8.7V
  • 输出功率(总):1.548W
  • 输出电流(最大):+15V 通道 40mA;-8.7V 通道 80mA
  • 最大容性负载:1000µF(每路,注意实际使用应考虑启动电流和纹波)
  • 输入电压范围:4.5V ~ 5.5V
  • 转换效率:典型 82%
  • 隔离电压:5kV rms
  • 开关频率:200kHz
  • 纹波噪声:100mV p-p(典型)
  • 工作温度范围:-40°C ~ +105°C
  • 尺寸(L×W×H):19.5 × 9.8 × 12.5 mm
  • 封装:SIP,19.5×9.8mm
  • 功能特性:短路保护、自动故障恢复

三、保护与可靠性特性

QA123-1509R3 配备输出短路保护机制,能够在输出异常(如短路或重载)时自动限制输出,避免模块损坏;当故障解除后,模块具备自恢复能力,无需人工干预。5kV rms 的隔离电压确保高电压系统中电气安全与抗干扰能力,适合高压侧与低压控制侧隔离要求较高的场合。宽温工作范围(-40°C ~ +105°C)也保证了在工业环境下的可靠性。

四、典型应用场景

QA123-1509R3 专为 IGBT 驱动系统设计,同时适用于多种工业电力电子设备:

  • 通用变频器(IGBT 驱动电源)
  • 交流伺服驱动系统(驱动板辅助电源)
  • 电焊机(驱动模块和控制逻辑供电)
  • 不间断电源(UPS)及其他需要隔离小功率偏置电源的系统

非对称输出能够在 IGBT 驱动中优化栅极充放电过程,减少驱动损耗并改善开关性能。

五、封装、尺寸与安装建议

模块采用 SIP 小封装(19.5×9.8mm),高度 12.5mm,体积小、便于在 PCB 上布局。建议安装时:

  • 保持模块与散热区域的空气流通,避免紧贴大面积热源;
  • 确保模块引脚焊接可靠,避免长时间振动或机械应力导致焊点疲劳;
  • 在需要高隔离耐压的应用中,注意 PCB 上的爬电距离和绝缘区设计,满足 5kV rms 隔离要求。

六、PCB 布线与使用注意事项

为保证稳健工作与低噪声输出,建议在 PCB 设计与系统集成时注意:

  • 输入端并联去耦:建议靠近模块输入端放置一只 10µF~100µF 的低 ESR 电解电容与一只 0.1µF 陶瓷并联,以抑制瞬态和高频噪声;
  • 输出端滤波:尽管模块支持最大 1000µF 容性负载,但过大的电容会带来启动电流冲击和稳定性问题,建议根据实际负载选择合适的滤波容值,并在输出端同时使用陶瓷与电解分层滤波;
  • 接地与走线:输入和输出的参考地应分别合理布局,减少长回流环路;保持高频开关回路短而粗;
  • 热管理:在高环境温度或接近额定输出时,考虑使用铜箔散热或通风方案降低模块工作温度;
  • 启动特性:含大电容的负载在上电瞬间会产生较大吸入电流,必要时在输入端加限流或软启动电路以防止输入电源电压跌落。

七、选型建议与常见问题

  • 若系统要求更高输出电流或更大功率,应选择同系列或其他系列更大功率等级的模块;
  • 对于对纹波与噪声敏感的模拟或测量电路,建议在输出端增加 L-C 滤波并做好接地屏蔽;
  • 在高海拔或极端环境中使用前,请与供应方确认是否需要额外认证或测试数据。

QA123-1509R3 以小尺寸、高隔离与短路自恢复特性,成为 IGBT 驱动及其他工业电力电子偏置电源的实用选择。对于需要在 5V 总线下提供 ± 驱动轨的设计,QA123-1509R3 提供了一种可靠且集成度高的解决方案。若需样品、详细数据手册或应用电路建议,可联系 YLPTEC(易川) 获取更详尽的技术支持。

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