WMSIC Electronic Components

YLPTEC B0505XT-2WR3 B0505XT

ModelB0505XT-2WR3
PackageSMD-5P
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B0505XT-2WR3
Type
YLPTEC
Minimum package
39 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B0505XT-2WR3
Electronic Component
1
Electronic Component
11.2mm
Package
SMD-5P
Type
Electronic Component
Electronic Component
Isolated Power Supply Module
Electronic Component
1.21g
Electronic Component
12.7mm
Electronic Component
7.25mm
Electronic Component
1
Electronic Component
BM0265023187
Operating Temperature
50℃~+115℃
Switching Frequency
260kHz
Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0505XT-2WR3 产品概述

一、产品简介

B0505XT-2WR3 是 YLPTEC(易川)推出的一款塑封单输出隔离型 DC-DC 转换器,额定输出功率 2W,输入电压范围 4.5V ~ 5.5V,输出为 5V/400mA。该器件采用 SMD-5P 表面贴装封装,体积小巧(12.7 × 11.2 × 7.25 mm),具有 1.5kV rms 的输入-输出隔离能力,适合对隔离、体积及效率有综合要求的嵌入式和工业电子应用。

二、主要电气参数

  • 类型:塑封型(SMD-5P)
  • 输入电压:4.5V ~ 5.5V
  • 输出电压:5V(非稳压型)
  • 输出功率:2W
  • 最大输出电流:400mA
  • 转换效率:典型 83%
  • 静态电流(无负载电流):5mA
  • 开关频率:260kHz
  • 纹波与噪声:50 mVp-p(典型)
  • 最大容性负载:2400 μF
  • 隔离电压:1.5 kV rms
  • 保护功能:短路保护、自动故障恢复
  • 工作温度:-50 ℃ ~ +115 ℃

三、特性与优势

  • 小体积、高功率密度:SMD-5P 封装配合 2W 输出,便于在空间受限的板级设计中集成。
  • 良好的隔离性能:1.5 kV rms 隔离可用于数字/模拟地分离、地环路抑制以及低压信号与高压系统间的安全隔离。
  • 可靠的保护机制:内置短路保护并具备自动恢复功能,发生短路或过载时可自动恢复工作,降低系统维护复杂度。
  • 低待机电流:5 mA 静态电流适合待机功耗受限的便携或长时间在线设备。
  • 宽温工作范围:-50 ℃ 至 +115 ℃,适应苛刻环境的工业级应用。

四、应用建议与注意事项

  • 非稳压型输出:由于为非稳压型器件,输出电压会随输入电压和负载变化,若系统对输出电压要求严格(例如对精密模拟电路或高速逻辑供电),建议在后端加稳压器或 LDO 做二次稳压。
  • 输出滤波与容性负载:器件支持最大 2400 μF 的输出容性负载,但较大的负载电容在上电或瞬变时可能引起启动电流与振荡,应在设计中评估软启动或限流需求。为降低纹波与噪声,建议在输出端并联合适的低 ESR 电容和必要的 PI/R-C 滤波网络。
  • 散热与 PCB 设计:尽管器件效率较高(≈83%),在满载情况下仍有功耗需通过 PCB 散热。建议在器件下方与周围留出散热铜箔面积,并使用多孔过孔(thermal vias)将热量传导至内层或底层铜箔。避免将热敏器件紧邻放置。
  • 隔离注意事项:1.5 kV rms 为常见的功能性隔离等级,若系统需要更高的安全隔离(例如医疗或更严格的安全标准),应确认系统整体绝缘需求与认证要求是否匹配。
  • EMC/噪声控制:开关频率 260 kHz 有利于减小外部电感体积,但仍需注意输入端熔断、差模/共模电感与滤波,合理布局地线和回流路径以降低电磁干扰。

五、典型应用场景

  • 工业控制模块:传感器接口、信号隔离与供电。
  • 通信设备:数字隔离电源、接口级电源。
  • 仪器仪表:板级隔离电源、测量系统的前端供电。
  • 嵌入式系统:需要小尺寸隔离供电的模块化设计。

六、选型提示

若需更严格的输出稳压或更高隔离电压,建议在系统层面结合后级稳压器或选择更高绝缘等级的器件。对 EMI、启动电流或极端环境(如高温长时间满载)有特殊要求时,应在原型阶段进行充分测试并优化 PCB 散热与滤波方案。

总结:B0505XT-2WR3 是一款针对板级隔离、体积受限场景优化的 5V/2W 非稳压型隔离 DC-DC 模块,兼具高效率、低功耗和自动故障恢复能力,适合在工业与嵌入式系统中作为基础隔离电源单元使用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.