WMSIC Electronic Components

YLPTEC B1212M-2WR3 B1212M

ModelB1212M-2WR3
PackageSIP-4
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B1212M-2WR3
Type
YLPTEC
Minimum package
43 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B1212M-2WR3
Electronic Component
1
Electronic Component
7.5mm
Package
SIP-4
Electronic Component
Isolated Power Supply Module
Electronic Component
2.194g
Electronic Component
11.5mm
Electronic Component
10mm
Electronic Component
1
Electronic Component
BM0264771641
Operating Temperature
40℃~+85℃
Switching Frequency
100kHz
Electronic Component
30mVp-p
Conversion
90%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B1212M-2WR3 产品概述

一、产品简介

B1212M-2WR3 是 YLPTEC(易川)推出的一款高性能隔离型 DC-DC 转换器,单通道输出,额定输出功率 2W。器件采用小尺寸 SIP-4 封装,适合空间受限的工业与通信设备。该模块在宽输入范围内工作,提供稳定的 12V 输出,集成多重保护功能,适用于需要高隔离、低噪声和高可靠性的系统设计。

二、主要技术参数

  • 输入电压 Vin:10.8V ~ 13.2V(典型 12V 系统匹配)
  • 输出电压 Vout:12V
  • 输出功率:2W,最大输出电流 168mA
  • 转换效率:约 90%(典型值可达 91%)
  • 静态电流:2mA(空载)
  • 纹波噪声:30mVp-p(20MHz 带宽,典型)
  • 开关频率:100kHz
  • 最大容性负载:560µF
  • 隔离电压:1500VDC / 1min(常规),3000VDC / 1s(耐压瞬态)
  • 工作温度:-40°C ~ +85°C
  • 外形尺寸:11.5mm × 7.5mm × 10mm(SIP-4 封装)
  • MTBF:≥ 3,500,000 小时

三、功能特点

  • 高隔离性:适配工业级隔离要求,降低地环路干扰风险。
  • 低空载功耗:空载功耗仅约 0.025W,适合对待机损耗敏感的应用。
  • 保护机制完善:具备持续短路保护并能自动恢复,具有过热保护与自动故障恢复功能,提高系统安全性与可维护性。
  • 低噪声输出:在 20MHz 带宽内典型纹波仅 30mVp-p,适合对噪声敏感的模拟与数字电路。
  • 高效率:典型效率接近或超过 90%,有利于散热与能耗控制。

四、可靠性与测试

产品通过严格的电气和环境测试,支持高达 1500VDC/1min 的工作隔离,并能承受 3000VDC/1s 的短时冲击。MTBF ≥ 3.5Mhrs,适合长期运行的工业、通信与医疗电源子系统。短路自动恢复和过温保护进一步提升长期可靠性。

五、典型应用场景

  • 工业控制与自动化设备的信号隔离与辅助电源
  • 通信设备与基站的供电模块
  • 仪器仪表与数据采集系统的隔离电源
  • 嵌入式系统、单片机外设供电与电平隔离

六、封装与引脚信息

  • 封装形式:SIP-4,体积小、便于插装或焊接于 PCB。
  • 外形尺寸:11.5 × 7.5 × 10 mm,易于在受限空间内布局。

七、选用建议

在选型时应关注输入电压裕量与负载瞬态需求,若系统有较大容性负载启动,应评估启动电流与模块的承受能力。对噪声敏感的模拟前端可在输入输出加适当滤波电容与共模电感以进一步抑制干扰。若需更高功率或多通道隔离,建议参考 YLPTEC 的其它系列产品。

如需全面的引脚定义、典型应用电路或样片评估,建议联系供应商获取详细数据手册与参考设计。

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