WMSIC Electronic Components

YLPTEC VRB2412YMD-6WR3 VRB2412YMD

ModelVRB2412YMD-6WR3
PackageDIP-5
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC VRB2412YMD-6WR3
Type
YLPTEC
Minimum package
40 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
VRB2412YMD-6WR3
Electronic Component
1
Electronic Component
25.4mm
Package
DIP-5
Electronic Component
Isolated Power Supply Module
Electronic Component
15.25g
Electronic Component
25.4mm
Electronic Component
11mm
Electronic Component
1
Electronic Component
BM0264771637
Operating Temperature
40℃~+85℃
Switching Frequency
250kHz
Electronic Component
80mVp-p
Conversion
82%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VRB2412YMD-6WR3 产品概述

一、概述

VRB2412YMD-6WR3 是 YLPTEC(易川)推出的一款单通道、6W 输出的隔离型DC-DC模块。模块采用2:1宽输入电压设计,适配18V36V直流供电,输出12V/500mA,体积小巧(25.4 × 25.4 × 11 mm,DIP-5封装),工作温度范围宽(-40℃+85℃),适合空间受限且对可靠性要求较高的工业与轨道交通、通信及医疗仪器等场景。

二、主要电气参数

  • 输入电压范围:18V ~ 36V(2:1 宽电压输入)
  • 输出电压:12V
  • 输出功率:6W(最大)
  • 输出电流:最大 500mA
  • 转换效率:典型 84%,规格参考值约 82%
  • 开关频率:250kHz
  • 纹波噪声:80 mVp-p(典型)
  • 最大容性负载:680 µF
  • 待机功耗:典型 0.3W
  • 隔离强度:1500 Vdc(等效 1.5 kV)

三、保护与可靠性特性

模块集成多重保护,包含输入欠压保护、输出过压保护、输出过流保护及短路保护,能在异常工况下保护负载与自身器件安全。裸机设计满足 CISPR32 / EN55032 Class A(测试条件下),并允许在-40℃到+85℃环境长期可靠工作。

四、机械与封装

  • 封装形式:DIP-5,便于插装与手工焊接或波峰/回流焊工艺改装
  • 外形尺寸:长 25.4 mm × 宽 25.4 mm × 高 11 mm
    小体积便于在背板、模块化设备或空间受限的系统中集成。

五、应用场景与优势

适用于医疗(非生命维持关键电路时)、工业控制、通信基站、仪器仪表及铁路等行业。主要优势包括:

  • 宽输入电压适应电源波动与分布式供电系统
  • 较高隔离等级,改善系统共模干扰与安全隔离需求
  • 多重保护提升系统稳定性与可维护性
  • 小尺寸与低待机功耗有利于节能与密集布板

六、应用建议与注意事项

  • 输入端建议增加适当的去耦电容与浪涌抑制元件,以减少启动时电压跌落与抑制瞬态。
  • 输出滤波时注意选用与模块兼容的低ESR电容,避免超过最大容性负载(680 µF)引发启动或稳态问题。
  • 实际系统设计需考虑散热与布局,尽量保证模块周围气流通畅,避免长时间满载在高温环境下工作。
  • 如需并联或冗余设计,请咨询厂方技术手册确认支持方式与限制。

如需更详细的电气曲线、引脚定义及典型应用电路,请参考官方数据手册或联系厂商技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.