WMSIC Electronic Components

YLPTEC B0515XT-2WR3 B0515XT

ModelB0515XT-2WR3
PackageSMD-5P,12.7x8.3mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B0515XT-2WR3
Type
YLPTEC
Minimum package
39 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B0515XT-2WR3
Electronic Component
1
Package
SMD-5P,12.7x8.3mm
Electronic Component
Isolated Power Supply Module
Electronic Component
1.072g
Electronic Component
12.7mm
Electronic Component
1
Electronic Component
BM0264518694
Operating Temperature
50℃~+115℃
Switching Frequency
260kHz
Type
Electronic Component
Conversion
86%
Output Power
2W
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0515XT-2WR3 产品概述

一、产品简介

B0515XT-2WR3 是一款单路隔离型小功率 DC-DC 转换器,输出功率 2W,输入电压范围 4.5V5.5V,输出电压 15V,最大输出电流 133mA。模块采用 SMD-5P 封装(尺寸 12.7×8.3mm),开关频率 260kHz,隔离电压 1.5kVrms,工作温度范围宽(-50℃+115℃),具有短路保护并能自动恢复,转换效率典型值 86%。产品由 YLPTEC(易川) 提供,专为板上需要产生与输入电源隔离电压的场合设计。

二、主要电气参数与特性

  • 输出通道数:1 路
  • 输入电压(Vin):4.5V ~ 5.5V
  • 输出电压(Vout):15V(非稳压型)
  • 输出功率:2W;最大输出电流:133mA
  • 转换效率:86%(典型)
  • 最大容性负载:2400µF(建议关注启动与稳定性)
  • 隔离电压:1.5kVrms(满足多数板级隔离需求,复杂环境下请按系统要求验证)
  • 开关频率:260kHz
  • 保护特性:短路保护,自动故障恢复
  • 工作温度:-50℃ ~ +115℃
  • 封装:SMD-5P,尺寸 12.7 × 8.3mm

此外,作为非稳压型输出,模块的输出电压对输入电压和负载变化会有一定敏感度,适用于输入电压较稳定并对输出精度要求不高的场合。

三、应用场景

B0515XT-2WR3 适合以下典型应用:

  • 纯数字电路的隔离供电(MCU、逻辑电路、隔离的数字接口)
  • 一般低频模拟电路(对噪声和稳定性要求不高的模拟放大或检测电路)
  • 继电器/小型执行器驱动电路(作为隔离供电源)
  • 板级隔离需求(消除地环路、保护前端与主电源隔离)
  • 通信接口隔离(如 RS485、CAN 等具有隔离需求的外设电源)

推荐用于输入电源稳定(±10%)且系统能容忍非严格稳压输出的场合。如需高精度或低纹波输出,可在本模块输出侧加稳压器或滤波器。

四、设计与使用建议

  • 输入侧建议加 10µF~47µF 的低 ESR 电解/固态电容做去耦,抑制输入瞬态。
  • 输出侧如需更低纹波或稳压输出,可并联低 ESR 电容并在后级增加线性稳压器(LDO)或开关稳压模块。注意最大容性负载 2400µF 的限制以免影响稳定性与启动行为。
  • 考虑到模块为非稳压型,若系统对输出精度敏感,请在设计中保证 Vin 在 ±10% 范围内稳定运行。
  • 防护与可靠性:输入侧可并接小熔丝或PTC以提高系统安全性;对于工业环境可增加 TVS 抑制器以应对瞬态冲击。
  • 隔离注意事项:模块提供 1.5kVrms 隔离,布线与器件布局应保证隔离爬电距离与系统安全规范一致。

五、性能估算与注意点

以满载输出 2W、效率 86% 为例,输入功率约为 2W / 0.86 ≈ 2.33W;在 Vin=5V 时,输入电流约为 0.466A。设计输入供电及走线时应考虑这一电流等级及一定裕量。模块短路保护为自动恢复型,发生短路后解除故障条件即可恢复输出,但频繁短路会影响可靠性,应避免长期过流工作。

总结:B0515XT-2WR3 以小尺寸、较高隔离等级及自动恢复保护为特色,适合用于对输出精度要求不高但需要隔离的小功率板级应用。选择时请结合系统对隔离等级、输出稳定性、纹波及温度范围的具体要求进行评估。若需进一步的电气特性曲线、引脚图或典型应用电路,可联系供应商获取详细数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.