WMSIC Electronic Components

YLPTEC B1224XT-2WR3 B1224XT

ModelB1224XT-2WR3
PackageSMD-5P
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B1224XT-2WR3
Type
YLPTEC
Minimum package
39 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B1224XT-2WR3
Electronic Component
1
Electronic Component
11.2mm
Package
SMD-5P
Electronic Component
Isolated Power Supply Module
Electronic Component
1.079g
Electronic Component
12.7mm
Electronic Component
7.25mm
Electronic Component
1
Electronic Component
BM0264518695
Operating Temperature
50℃~+115℃
Switching Frequency
450kHz
Type
Electronic Component
Electronic Component
80mVp-p

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B1224XT-2WR3 产品概述

一、产品概述

B1224XT-2WR3 是 YLPTEC(易川) 推出的单输出隔离DC-DC模块,额定输出功率2W,专为板上电源系统中需产生与输入电源隔离的小功率电压场合设计。模块体积小、温度范围宽,适合纯数字电路、一般低频模拟电路及继电器驱动等对输出稳压要求不高的应用。

二、主要性能参数

  • 输入电压:10.8V ~ 13.2V(典型12V输入,允许±10%范围)
  • 输出电压:24V(非稳压型)
  • 最大输出电流:83mA,最大功率2W
  • 转换效率:85%(典型)
  • 隔离耐压:1500Vrms(标称,约2121VDC)
  • 最大容性负载:2400µF
  • 开关频率:450kHz;纹波噪声:80mVp-p;静态电流:5mA
  • 工作温度:-50℃ ~ +115℃;封装:SMD-5P;尺寸:12.7 × 11.2 × 7.25 mm

三、功能与保护

  • 短路保护:带短路保护并具自动故障恢复功能,出现过载或短路后模块会自动恢复工作,无需人工复位。
  • 非稳压型输出:输出随输入电压与负载变化而变化,适合对输出精度要求不高的场合。

四、典型应用

  • 板级隔离电源:为控制器、通信接口或测量电路提供与主电源隔离的参考电压。
  • 继电器驱动与开关量电路:为驱动器或继电器线圈提供隔离驱动电压。
  • 低频模拟及纯数字电路:当对纹波、稳压要求不高且输入源稳定时使用效果最佳。

五、设计与使用建议

  • 若需更高精度或更低噪声,建议在输出端增加后级线性稳压或LC滤波。
  • 注意隔离耐压与系统要求匹配:本模块隔离1500Vrms,适用于对隔离要求不超过此值的场合。
  • 最大容性负载不超过2400µF,超大容性负载可能造成启动问题或不稳定。
  • 封装体积小,散热依赖PCB铺铜,建议在PCB上做适当散热处理并遵循制造商焊接工艺。

如需器件样品、典型接线图或更详细的温升与EMC资料,可提供进一步技术支持与应用参考。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.