WMSIC Electronic Components

YLPTEC B0303S-2WR3 B0303S

ModelB0303S-2WR3
PackageSIP-4
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B0303S-2WR3
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B0303S-2WR3
Electronic Component
1
Package
SIP-4
Electronic Component
Isolated Power Supply Module
Electronic Component
1.8g
Electronic Component
10mm
Electronic Component
1
Electronic Component
BM0264518716
Operating Temperature
40℃~+85℃
Switching Frequency
100kHz
Type
Electronic Component
Electronic Component
100mVp-p
Conversion
80%
Output Power
2W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0303S-2WR3 产品概述

一、概述

B0303S-2WR3 属于 YLPTEC(易川) B_S-2WR3 系列,是一款体积小、效率高的微功率隔离型 DC/DC 模块。模块为单路输出、定电压、输入与输出隔离的非稳压型电源,适用于在板上产生与输入电源隔离电压的场合,尤其适合数字电路、低频模拟、继电器驱动和数据交换等对输出精度要求不高的应用。

二、主要参数

  • 输出通道数:1
  • 输出功率:2W
  • 工作电压 Vin:2.97V ~ 3.63V
  • 输出电压 Vout:3.3V(非稳压型)
  • 最大输出电流:606mA
  • 转换效率:约 80%
  • 最大容性负载:2400µF
  • 隔离电压 Vrms:1.5kV(1500Vrms)
  • 开关频率:100kHz
  • 纹波噪声:100mVp-p
  • 保护特性:短路保护、自动故障恢复、过热保护
  • 工作温度:-40℃ ~ +85℃
  • 封装:SIP-4,高度 10mm

三、功能与保护

模块具有短路保护与自动故障恢复功能,可在异常后自动恢复输出;配备过热保护以防持续过载或散热不良导致的损伤。由于为非稳压设计,输出随输入电压和负载变化而变化,需在系统设计时予以考虑。

四、典型应用场景

  • 板级隔离电源需求(通信、接口隔离)
  • 纯数字电路供电(逻辑、MCU外围)
  • 继电器驱动与低频开关负载
  • 数据交换电路、隔离测量前端(对精度要求不高的场合)

五、设计与使用建议

  • 输入要求稳定,建议 Vin 在标称值±10% 范围内(2.97–3.63V)。
  • 虽然模块内部已实现一定滤波,仍建议在输入端配置合适的去耦电容(例如 10µF 低 ESR)以抑制瞬态;输出端滤波电容不得超过 2400µF。
  • 由于为非稳压型,若系统对输出精度敏感,应采用后端稳压或稳压型模块。
  • 注意散热与环境温度,尽量保证良好通风,避免长期满载运行。
  • 布局时将输入/输出去耦电容尽量靠近模块引脚,保持信号与大电流回流分离,确保隔离区的爬电距离与绝缘要求满足系统安全规范。
  • 虽有短路自动恢复功能,但应避免长时间短路或频繁故障循环,必要时在前端加熔断或限流保护。

六、封装与选型

  • 封装形式:SIP-4,模块高度 10mm,适合插装或点对点焊接的板上安装方案。
  • 系列型号:B_S-2WR3,订购时请确认完整型号(B0303S-2WR3)与技术规格匹配实际应用需求。

七、注意事项

  • 确认应用场合对“非稳压”特性的接受度;若需精确稳定电压请选择稳压型或加稳压后端。
  • 设计前请参考厂家完整数据手册以获取引脚定义、典型应用电路与详细机械尺寸,保证安装与安全符合系统要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.