WMSIC Electronic Components

YLPTEC A0524XT-1WR3 A0524XT

ModelA0524XT-1WR3
PackageSMD,15.2x8.5mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC A0524XT-1WR3
Type
YLPTEC
Minimum package
33 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
A0524XT-1WR3
Electronic Component
1
Electronic Component
8.5mm
Package
SMD,15.2x8.5mm
Electronic Component
Isolated Power Supply Module
Electronic Component
2.774g
Electronic Component
15.2mm
Electronic Component
7.3mm
Electronic Component
1
Electronic Component
BM0264771711
Operating Temperature
40℃~+105℃
Switching Frequency
330kHz
Type
Electronic Component
Electronic Component
80mVp-p

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

A0524XT-1WR3 产品概述

A0524XT-1WR3 是 YLPTEC(易川)推出的一款小型隔离型双路 DC-DC 变换器,采用 SMD 封装(15.2 × 8.5 × 7.3 mm),面向数字与一般低频模拟电路的隔离供电需求。模块输入为定电压设计,工作电压 Vin = 5.5V,提供两个隔离非稳压输出 Vout = 24V,整机输出功率 1W,单路最大输出电流 21mA(两路合计受总功率限制),隔离电压达 1500 Vrms。

一、主要参数

  • 输入电压:5.5 V(定电压输入)
  • 输出通道:2 路,输出电压:24 V(非稳压型)
  • 输出功率:1 W(整机)
  • 输出电流:最大 21 mA(单路)
  • 隔离电压:1500 Vrms
  • 转换效率:典型 85%,最高可达 86%
  • 开关频率:330 kHz
  • 静态电流(空载):14 mA
  • 纹波噪声:80 mV p-p
  • 最大容性负载:110 µF
  • 工作温度:-40 ℃ ~ +105 ℃
  • 封装:SMD,尺寸 15.2 × 8.5 × 7.3 mm
  • 功能:短路保护、自动故障恢复

二、核心特性

  • 高绝缘强度:1500 Vrms 隔离,适合地线分离与信号隔离场合。
  • 可持续短路保护且自动恢复,简化可靠性设计。
  • 小型 SMD 封装,适合 PCB 高密度设计。
  • 非稳压输出适合对负载变化不敏感的数字电路或后端加稳压器的场景。
  • 较高效率与低静态电流,利于功耗受限的系统。

三、典型应用场合

  • 纯数字电路隔离供电(微控制器、隔离通信接口等)。
  • 一般低频模拟电路(对输出纹波容忍度较高的测控模块)。
  • 工业通信、传感器前端、数据采集系统的隔离电源。
  • 需要轻度隔离保护且空间受限的便携设备。

四、使用建议与注意事项

  • 由于为非稳压输出,建议在负载端并联适当稳压或滤波电路以保证关键点电压稳定。
  • 注意总输出功率限制,双路负载不可同时超额使用,按总功率和热设计配合使用。
  • 输出端容性负载不超过 110 µF,以防振荡或启动问题。
  • 输入端应加足够的去耦电容(低 ESR)以抑制输入纹波和瞬态。
  • 在高温或高电流条件下注意散热与 PCB 热管理。

五、机械与可靠性信息

  • 封装引脚符合国际标准引脚方式,便于自动贴片与回流焊工艺。
  • 额定工作温度 -40 ℃ 至 +105 ℃,适应工业级环境。
  • 自带短路保护与自动恢复,提高现场可靠性与可维护性。

订货与技术支持请注明型号 A0524XT-1WR3,品牌 YLPTEC(易川),并提供工作环境与负载要求,便于选型与应用建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.