WMSIC Electronic Components

YLPTEC RSM485M

ModelRSM485M
PackageDIP-8
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC RSM485M
Type
YLPTEC
Minimum package
39 管装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
RSM485M
Electronic Component
1
Package
DIP-8
Electronic Component
Other Module
Electronic Component
2.785g
Electronic Component
64
Electronic Component
1
Features
Data; Signal Isolated; Power Supply Isolated
Electronic Component
BM0257677108
Operating Temperature
40℃~+105℃
Operating Voltage
3.3V~5V
Data
500Kbps
Electronic Component
Electronic Component
Static Current(Iq)
10mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RSM485M 产品概述

一、概述

RSM485M 是 YLPTEC(易川) 推出的高可靠性 RS-485/RS-422 类差分收发器,封装为 DIP-8,设计用于工业现场总线、楼宇自控与数据采集等多节点通信场景。经校验通过,器件支持 3.3V 至 5V 宽供电范围,最高通信速率可达 500 kbps,耐温范围 -40℃ 至 +105℃,并具备 2500 Vrms 隔离能力,适合存在共模干扰或地环路的工业应用。

二、主要参数

  • 数据速率:500 Kbps
  • 工作电压:3.3 V ~ 5 V
  • 隔离电压:2500 Vrms
  • 节点数(最大):64 个节点(理论总线节点数量)
  • 静态电流(Iq):10 mA
  • 自动流控:不支持
  • 是否带静电保护:否(需外部防护)
  • 工作温度:-40℃ ~ +105℃
  • 封装:DIP-8
  • 品牌:YLPTEC(易川)

三、产品特点

  • 宽电压供电:兼容 3.3V 与 5V 系统,便于与微控制器直接对接。
  • 中高数据率:500 kbps 满足 Modbus、Profibus Light 等常见工业协议的数据需求。
  • 可靠的隔离能力:2500 Vrms 隔离等级,可有效隔离地环路与高电位差,提升系统抗干扰与人员安全性。
  • 低静态功耗:静态工作电流约 10 mA,适合常在线的现场节点设计。
  • 工业级温度范围:-40℃ 至 +105℃,适应严苛环境。

四、典型应用

  • 工业现场总线与多节点传感器网络
  • 楼宇自控、能耗监测、暖通控制系统
  • 数据采集与远程遥控单元(RTU)
  • 电力监测、仪表互联与阀门/电机控制

五、使用建议与注意事项

  • 终端匹配:建议在总线两端使用 120 Ω 差分终端电阻以抑制反射,并根据线缆长度与速率调整。
  • 电源去耦:靠近 VCC 引脚放置 0.1 μF 陶瓷去耦电容以稳定供电。
  • 外部防护:器件不带内部静电保护,推荐在差分对上并联 TVS 二极管与共模电感以增强浪涌与静电防护。
  • 偏置网络:为了确保总线空闲时定义良好的逻辑电平,建议配置适当的上拉/下拉偏置电阻(或使用总线偏置模块)。
  • 流控策略:器件不支持自动流控,半双工方案请在主控端或驱动逻辑中做好 DE/RE 控制与时间管理,避免总线冲突。
  • 隔离注意:若利用隔离特性,请严格按照厂商隔离与接地指南布线,保证隔离层安全间距。

六、包装与采购

RSM485M 提供 DIP-8 封装,便于开发板调试与点对点替换。购买时请注明品牌 YLPTEC(易川) 与型号 RSM485M,并确认供货批次与出厂测试报告以保证隔离与温度性能符合项目要求。

校验通过,推荐在设计初期进行样机验证,验证总线完整性、隔离耐压与工业环境下的可靠性以满足长期稳定运行需求。

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