Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B0312S-1WR3 是 YLPTEC(易川)推出的一款小体积单路隔离型DC-DC升压模块,额定输出功率1W,专为3.3V系统提升到12V封装应用而设计。模块采用SIP小封装(11.6×6mm),尺寸仅11.5×6×10mm,适合空间受限的嵌入式与便携设备。
模块集成短路保护与过热保护,遇异常后具备自动故障恢复功能,便于系统无人工干预的自我恢复。隔离性能达到1.5kV rms,可用于需要隔离地或隔离信号的应用场景,提升系统安全性与抗干扰能力。
满载时转换效率约83%,换算出的功耗损耗约0.20W(1W/0.83 - 1W),热量不大但在密集布局或高环境温度下仍需注意散热与封装热阻。输入电压下限2.97V,给3.3V供电系统留有较小裕量,建议保证供电稳定,避免启动或瞬态掉压导致输出异常。输出允许560µF最大容性负载,配合近端去耦电容可优化瞬态响应与纹波,但应避免超出厂商推荐值导致振荡。
开关频率100kHz,对低频干扰友好但仍需关注传导与辐射干扰。建议:
适用于便携式设备、小型传感器节点、工业控制、通讯模块及需将3.3V提升至隔离12V的电路场合。适配光耦驱动、隔离供电的模拟/数字电路以及小电流驱动负载。
品牌:YLPTEC(易川);封装类型:SIP小封装(11.6×6mm,实际尺寸11.5×6×10mm)。采购或设计时,请参考厂商详细数据手册以获取引脚排列、典型曲线与更详细的环境/安全规范。
如需进一步的电气特性曲线、典型应用电路或PCB示意图,我可以提供参考图与元件选型建议。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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