WMSIC Electronic Components

YLPTEC B0312S-1WR3 B0312S

ModelB0312S-1WR3
PackageSIP,11.6x6mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B0312S-1WR3
Type
YLPTEC
Minimum package
43 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B0312S-1WR3
Electronic Component
1
Electronic Component
6mm
Package
SIP,11.6x6mm
Electronic Component
Isolated Power Supply Module
Electronic Component
2.7g
Electronic Component
11.5mm
Electronic Component
10mm
Electronic Component
1
Electronic Component
BM0265023188
Operating Temperature
40℃~+85℃
Switching Frequency
100kHz
Electronic Component
30mVp-p
Conversion
83%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0312S-1WR3 产品概述

一、产品简介

B0312S-1WR3 是 YLPTEC(易川)推出的一款小体积单路隔离型DC-DC升压模块,额定输出功率1W,专为3.3V系统提升到12V封装应用而设计。模块采用SIP小封装(11.6×6mm),尺寸仅11.5×6×10mm,适合空间受限的嵌入式与便携设备。

二、主要规格

  • 输入电压:2.97V ~ 3.63V(适配3.3V系统)
  • 输出电压:12V(固定)
  • 输出电流(最大):84mA,输出功率1W
  • 转换效率:典型83%(满载时)
  • 最大容性负载:560µF
  • 隔离电压(Vrms):1.5kV
  • 开关频率:100kHz
  • 纹波噪声:30mV p-p(典型)
  • 工作温度:-40℃ ~ +85℃
  • 保护特性:短路保护、自动故障恢复、过热保护
  • 封装:SIP,尺寸约11.6×6mm;实际长×宽×高:11.5×6×10mm

三、保护与可靠性

模块集成短路保护与过热保护,遇异常后具备自动故障恢复功能,便于系统无人工干预的自我恢复。隔离性能达到1.5kV rms,可用于需要隔离地或隔离信号的应用场景,提升系统安全性与抗干扰能力。

四、热管理与电气注意事项

满载时转换效率约83%,换算出的功耗损耗约0.20W(1W/0.83 - 1W),热量不大但在密集布局或高环境温度下仍需注意散热与封装热阻。输入电压下限2.97V,给3.3V供电系统留有较小裕量,建议保证供电稳定,避免启动或瞬态掉压导致输出异常。输出允许560µF最大容性负载,配合近端去耦电容可优化瞬态响应与纹波,但应避免超出厂商推荐值导致振荡。

五、EMI 与布板建议

开关频率100kHz,对低频干扰友好但仍需关注传导与辐射干扰。建议:

  • 输入/输出去耦电容靠近引脚放置;
  • 保持输入、输出回路面积最小化,缩短高频回流路径;
  • 在隔离区留足爬电与间隙距离,避免打穿绝缘;
  • 必要时在输入端加保险丝或TVS以防浪涌、反向连接。

六、典型应用场景

适用于便携式设备、小型传感器节点、工业控制、通讯模块及需将3.3V提升至隔离12V的电路场合。适配光耦驱动、隔离供电的模拟/数字电路以及小电流驱动负载。

七、封装与采购

品牌:YLPTEC(易川);封装类型:SIP小封装(11.6×6mm,实际尺寸11.5×6×10mm)。采购或设计时,请参考厂商详细数据手册以获取引脚排列、典型曲线与更详细的环境/安全规范。

如需进一步的电气特性曲线、典型应用电路或PCB示意图,我可以提供参考图与元件选型建议。

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