WMSIC Electronic Components

YLPTEC TD521D485H-A TD521D485H

ModelTD521D485H-A
PackageDIP-8
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC TD521D485H-A
Type
YLPTEC
Minimum package
30 管装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
TD521D485H-A
Electronic Component
1
Package
DIP-8
Electronic Component
RS485Bus Module
Electronic Component
5.899g
Electronic Component
128
Electronic Component
1
Features
Data; Signal Isolated; Power Supply Isolated
Electronic Component
BM0265369249
Operating Temperature
40℃~+85℃
Operating Voltage
4.75V~5.25V
Data
500Kbps
Electronic Component
Electronic Component
Static Current(Iq)
30mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TD521D485H-A 产品概述

一、核心功能定位

TD521D485H-A是YLPTEC(易川)推出的工业级隔离型RS485收发器,专为中低速多节点通信场景设计,集成自动流控、静电防护与高隔离特性,可稳定适配-40℃~+85℃宽温度范围,满足工业自动化、楼宇自控等领域的抗干扰、多设备组网需求,无需额外扩展电路即可实现可靠通信。

二、关键参数深度解析

1. 通信性能参数

  • 数据速率:支持最高500Kbps传输,覆盖工业现场传感器采集、PLC间通信等常见中低速应用,无需速率适配电路;
  • 节点数:最大128个节点组网,通过RS485总线实现数十台设备级联,适合分布式控制系统;
  • 自动流控:内置自动流控功能,无需软件或手动切换DE/RE引脚,收发方向自动切换,简化硬件设计。

2. 电气与隔离特性

  • 工作电压:4.75V~5.25V宽电压范围,兼容常规5V电源系统,适应电源波动场景;
  • 隔离电压:2500Vrms(有效值)隔离能力,阻断总线与设备侧电气干扰,保护后端MCU、PLC等敏感电路;
  • 静电保护:集成ESD防护电路,符合工业级标准,抵御常见静电放电干扰。

3. 功耗与温度特性

  • 静态电流:典型值30mA,功耗适中,适合长期不间断运行的工业设备;
  • 工作温度:-40℃~+85℃工业级范围,适配严寒(户外交通)或高温(工厂车间)环境,无需额外散热。

三、典型应用场景

TD521D485H-A的特性适配多类场景:

  1. 工业自动化:PLC与远程I/O、温度/压力传感器组网,128节点支持实现多设备级联,隔离特性避免车间电磁干扰;
  2. 楼宇自控:HVAC控制器、安防摄像头通信,自动流控简化数据交互,宽温适配楼宇不同区域;
  3. 智能交通:交通信号机、车检器链路,2500Vrms隔离防雷击/高压,-40℃低温满足北方户外应用;
  4. 电力监控:配电终端(FTU/DTU)与主站通信,静电保护提升抗干扰,500Kbps速率满足实时数据上传。

四、核心优势总结

  1. 高隔离防护:2500Vrms隔离阻断跨总线干扰,提升系统抗干扰能力;
  2. 多节点兼容:128节点支持满足分布式组网,无需额外扩展芯片;
  3. 设计简化:自动流控消除手动切换电路,降低BOM成本与PCB空间;
  4. 工业级可靠性:宽温、静电防护与宽电压,适配恶劣环境;
  5. 易安装封装:DIP-8通孔封装,适合手工焊接与批量生产,兼容性强。

五、封装与可靠性保障

TD521D485H-A采用DIP-8(双列直插)封装,引脚布局符合RS485标准,可直接替换同类隔离器件。YLPTEC通过严格工业级测试(温度循环、静电放电、绝缘耐压),确保长期运行稳定,适合可靠性要求高的工业场景。

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