WMSIC Electronic Components

YLPTEC TD301D485

ModelTD301D485
PackageDIP-8
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC TD301D485
Type
YLPTEC
Minimum package
30 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
TD301D485
Electronic Component
1
Package
DIP-8
Electronic Component
RS485Bus Module
Electronic Component
6.3g
Electronic Component
64
Electronic Component
1
Features
Signal Isolated; Power Supply Isolated
Electronic Component
BM0265369263
Operating Temperature
40℃~+85℃
Operating Voltage
3.15V~3.45V
Data
9.6Kbps
Electronic Component
Electronic Component
Static Current(Iq)
30mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YLPTEC TD301D485 半双工RS485收发器产品概述

一、产品定位与核心应用方向

YLPTEC TD301D485是一款专为工业级低速通信场景设计的半双工RS485收发器,核心定位为小型工业网络的可靠通信链路节点。其低速设计(9.6Kbps)匹配低数据量传输需求,同时具备强抗干扰、多节点组网能力,典型应用包括:

  • 工业传感器数据采集(温湿度、压力传感器组网);
  • 小型PLC(可编程逻辑控制器)间指令交互;
  • Modbus RTU低速通信总线扩展;
  • 智能家居局部控制网络(如灯光、窗帘集中控制)。

二、关键技术参数解析

1. 通信性能参数

  • 数据速率:9.6Kbps(低速设计降低误码风险,适配小数据量传输场景);
  • 节点数:64个(支持64节点并行接入,满足中小型工业网络多设备需求)。

2. 电气与功耗参数

  • 工作电压:3.15V~3.45V(精准匹配3.3V系统,兼容主流单片机、PLC,无需电平转换);
  • 静态电流:30mA(工作状态电流稳定,抗电源波动能力强,减少电路噪声干扰)。

3. 隔离与防护参数

  • 隔离电压:2500Vrms(电气隔离阻断共地干扰、浪涌电压,保护后端电路);
  • 静电保护:内置ESD防护(符合工业级标准,降低生产/使用中静电损坏风险)。

4. 环境适应性参数

  • 工作温度:-40℃~+85℃(工业级宽温范围,覆盖严寒、高温极端环境,适配户外/车间场景)。

三、核心功能特性

1. 半双工通信模式

无自动流控设计,通信逻辑简单可靠,适合双向数据传输(如传感器数据上传+控制指令下发),无需复杂流控算法,降低软件开发难度。

2. 多节点组网兼容

支持64节点并行接入,通过地址码区分设备,构建总线型网络无需额外集线器/交换机,简化系统架构。

3. 强抗干扰防护

  • 2500Vrms隔离:阻断不同设备共模干扰,避免地电位差导致的通信故障;
  • 内置ESD防护:应对人体静电、设备放电等冲击,提升生产/使用稳定性。

4. 3.3V系统无缝适配

工作电压精准匹配3.3V核心器件,无需电平转换芯片(如MAX232),简化电路设计,降低BOM成本与PCB布局复杂度。

四、封装与应用便捷性

采用DIP-8通孔封装,具备三大优势:

  • 手工焊接友好:引脚间距符合通孔标准,适合原型开发阶段手工调试;
  • 批量生产适配:支持波峰焊、回流焊等工艺,提升生产效率;
  • 引脚布局标准:符合RS485通用定义,可直接替换同类DIP-8器件,降低电路替换成本。

五、品牌与品质保障

YLPTEC(易川)作为工业级电子器件品牌,TD301D485经过严格可靠性测试(高低温循环、振动、浪涌测试等),符合RoHS环保标准,且提供技术支持与售后保障,确保工业场景下长期稳定运行。

该产品以“低速稳定+高抗干扰+低成本”为核心优势,是小型工业通信网络的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.