WMSIC Electronic Components

YLPTEC B0505S-2W B0505S

ModelB0505S-2W
PackageSIP,19.5x7mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC B0505S-2W
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
B0505S-2W
Electronic Component
1
Electronic Component
10mm
Package
SIP,19.5x7mm
Electronic Component
Isolated Power Supply Module
Electronic Component
3.12g
Electronic Component
19.5mm
Electronic Component
7mm
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0265023168
Operating Temperature
40℃~+85℃
Switching Frequency
300kHz
Electronic Component
60mVp-p

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B0505S-2W 产品概述

一、产品简介

B0505S-2W 是 YLPTEC(易川) 推出的单通道隔离型直流-直流转换器,专为分布式电源系统中需要产生与输入电源隔离的 5V 输出场合设计。器件小巧、效率高,适合要求输入输出电气隔离但对输出精度和纹波噪声要求不高的应用。

二、主要参数

  • 输入电压:4.5V ~ 5.5V
  • 输出电压:5V(单路)
  • 输出功率:2W,最大输出电流 200mA
  • 转换效率:约 90%
  • 隔离电压(Vrms):1500V(1.5kV)
  • 开关频率:300kHz
  • 输出纹波噪声:约 60mVp-p
  • 最大容性负载:200µF
  • 工作温度:-40℃ ~ +85℃

三、功能特性与保护

器件内置短路保护功能,可在异常负载或短路情况下提供保护,提高系统可靠性。高效率设计减小了功耗与发热,但在高温或满载条件下仍需注意散热和降额使用。隔离特性可用于消除地环路、提升系统抗干扰能力与安全性。

四、封装与尺寸

封装形式:SIP,典型尺寸为长 19.5mm × 宽 10mm × 高 7mm,适合板上插装或项目模块化布置。体积小、重量轻,便于在受限空间内集成。

五、应用场景与选型建议

适合通信设备、工业控制、数据采集、传感器前端、继电器驱动、地环路隔离以及任何需要输入输出电气隔离且输入电压波动在 ±10% 内的场合。选型时应确认:输入电压稳定在 4.5–5.5V、最大负载不超过 200mA、所需隔离等级不超过 1.5kV,并考虑输出纹波是否满足系统要求。

六、使用与注意事项

  • 输出端允许接最大 200µF 的容性负载,超过该值可能影响稳定性。
  • 推荐在输入端并联适当去耦电容以抑制瞬态,必要时在输出端加低 ESR 电容以减少纹波。
  • 安装时注意隔离间距与爬电距离,满足系统安全规范。
  • 在高温或满载工况下建议适度降额使用,并预留散热空间。
  • 如需更详细的保护行为(例如短路恢复模式)或电气特性曲线,请参考厂商资料或咨询技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.