WMSIC Electronic Components

YLPTEC QA051C

ModelQA051C
PackageSIP-5
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC QA051C
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
QA051C
Electronic Component
1
Electronic Component
9.8mm
Package
SIP-5
Electronic Component
Isolated Power Supply Module
Electronic Component
5.15g
Electronic Component
19.5mm
Electronic Component
12.5mm
Electronic Component
1
Electronic Component
BM0264518691
Operating Temperature
40℃~+105℃
Switching Frequency
100kHz
Electronic Component
40mVp-p
Conversion
79%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

QA051C 双路隔离式DC-DC模块(用于SiC驱动)

一、产品简介

QA051C(品牌:YLPTEC/易川)是一款针对SiC门极驱动器设计的双路隔离DC-DC电源模块,采用两路共地输出结构,可同时为SiC器件的开通与关断回路提供独立电源。模块体积小、效率高并具备完善的保护功能,适合工控与功率电子系统中对隔离供电要求较高的场合。

二、主要性能参数

  • 输入电压(Vin):4.5V ~ 5.5V
  • 输出:双路共地输出,Vout1 = -5V(最大40mA);Vout2 = +20V(最大80mA)
  • 转换效率:典型79%,最高可达82%
  • 最大容性负载:100μF(建议按应用评估)
  • 隔离电压:3500Vrms(等效6000VDC)
  • 开关频率:100kHz
  • 静态电流(不带载):53mA
  • 纹波噪声:约40mVp-p
  • 工作温度:-40℃ ~ +105℃
  • 输出短路保护:支持短路保护与自动故障恢复

三、功能与保护

  • 短路保护与自恢复:在输出过流或短路情况下模块进入保护状态,故障解除后自动恢复供电,便于系统连续运行与维护。
  • 双路共地输出:两路输出共享同一输出地,便于门极驱动回路的连接与布局,但与输入端保持电气隔离,满足隔离驱动要求。
  • 低噪声设计:40mVp-p的输出纹波适配对噪声敏感的驱动电路,结合适当滤波能进一步提升驱动稳定性。

四、典型应用

  • 通用变频器与逆变器的SiC门极驱动供电
  • 交流伺服驱动系统
  • 电焊机、电源转换设备
  • 不间断电源(UPS)与其它工业电源隔离电源模块应用

五、封装与机械信息

  • 封装:SIP-5(SIP 5引脚)
  • 外形尺寸:长 19.5mm × 宽 9.8mm × 高 12.5mm
  • 适合通过插针或插件方式在标准PCB上实现可靠安装与散热

六、设计与使用建议

  • 输入与输出端建议加入适当的去耦电容(低ESR陶瓷及电解并联),以抑制瞬态与降低纹波。输出端容性负载上限建议不超过100μF。
  • 布局时输入线与输出线应尽量缩短并注意散热空间,长期高负载下注意功率损耗与散热。
  • 若系统对输出共地与隔离有特殊要求,请在方案初期确认两路输出的共地特性是否满足整体拓扑。
  • 推荐在驱动电路中增加额外的软启动、滤波或限流措施以提升系统可靠性。

七、品牌与采购

  • 品牌:YLPTEC(易川)
  • 型号:QA051C,封装SIP-5。如需批量采购或索取完整电气特性曲线、典型应用电路图及认证资料,请联系供应商或经销商获取数据手册与样品支持。

QA051C以其高隔离等级、双路共地输出与自动恢复保护,成为SiC门极驱动与工业电源中紧凑型隔离供电的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.