WMSIC Electronic Components

YLPTEC LS05-13B09R3 AC Converter LS05

ModelLS05-13B09R3
PackageSIP,26.4x17.6mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC LS05-13B09R3
Type
YLPTEC
Minimum package
140 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
LS05-13B09R3
Electronic Component
1
Electronic Component
11mm
Package
SIP,26.4x17.6mm
Type
Electronic Component
Electronic Component
AC-DC Power Supply Module
Electronic Component
4.9g
Electronic Component
26.4mm
Electronic Component
17.6mm
Electronic Component
1
Electronic Component
BM0264335032
Operating Temperature
40℃~+85℃
Electronic Component
80mVp-p
Conversion
77%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YLPTEC LS05-13B09R3 AC/DC电源模块产品概述

一、产品定位与核心价值

YLPTEC(易川)LS05-13B09R3是一款小功率隔离式AC/DC电源模块,针对紧凑空间、宽电压输入、高安全需求的场景设计,主打“宽适配、小体积、高可靠”三大核心价值,为智能家居、工业控制、通信终端等领域提供稳定的9V/5W直流供电。

二、超宽输入电压适配能力

这款模块的输入兼容性是核心优势之一,同时支持交流(AC)和直流(DC)双输入:

  • 交流输入:85VAC~305VAC(有效值),覆盖全球主流市电(110V/220V/240V),即使电网波动±20%(如部分地区电网电压波动至100V或280V)也能稳定工作,无需额外设计降压/升压电路;
  • 直流输入:100V~430V,适配工业直流母线(常见240V、380V)、光伏储能系统的直流输出,可直接对接高压直流电源,简化系统架构。

三、精准稳定的输出性能

输出端针对小功率设备的供电需求做了优化,核心参数表现均衡:

  • 输出规格:固定9V直流,最大输出电流560mA(额定功率5W),满足小型MCU、传感器、无线模块等低功耗设备的供电;
  • 纹波噪声:80mVp-p(峰峰值),属于低纹波范围,适合对电源纯净度敏感的场景(如高精度传感器、音频设备);
  • 静态功耗:仅0.1W,待机时耗电极低,符合欧盟ErP、中国GB节能标准,适合长期通电的智能家居、工业待机设备;
  • 转换效率:77%,在5W小功率模块中表现优异,减少发热无需额外散热设计,降低系统成本。

四、多重安全保护与隔离设计

针对设备安全和可靠性,模块内置多重保护机制,同时具备高隔离特性:

  • 过流保护(OCP):输出电流超过额定值时自动切断,防止负载过载或短路损坏模块;
  • 短路保护(SCP):输出短路时快速响应,故障排除后可自动恢复(无需手动重启);
  • 高隔离电压:4kVrms(交流有效值),满足电气隔离要求,可有效阻断高压侧对低压侧的干扰,保护人员和敏感设备安全,符合工业安规(如UL、CE)的基本要求。

五、紧凑封装与物理特性

采用SIP(单列直插式)封装,物理尺寸仅26.4mm(长)×11mm(宽)×17.6mm(高),具有以下优势:

  • 体积小巧,适合空间受限的设备(如小型仪器、智能家居网关、工业传感器节点);
  • SIP插装方式焊接方便,无需复杂的贴片工艺,降低PCB设计难度;
  • 最大容性负载680uF,可直接驱动带大电容滤波的负载,无需额外限流电路,进一步简化系统设计。

六、典型应用领域

结合参数特性,LS05-13B09R3的核心应用场景包括:

  1. 智能家居:智能网关、温湿度传感器、安防摄像头(待机功耗低);
  2. 工业控制:PLC的I/O模块供电、工业压力/温度传感器(宽直流输入适配);
  3. 通信设备:小型无线路由器、光纤收发器(全球市电适配);
  4. 消费电子:蓝牙耳机充电盒、智能手表充电器(小体积、高隔离);
  5. 光伏储能:光伏逆变器辅助控制电源、储能BMS辅助供电(直流输入适配)。

七、选型核心优势总结

对比同类小功率AC/DC模块,LS05-13B09R3的差异化优势清晰:

  • 超宽输入覆盖:AC+DC双输入,无需区分电源类型,简化系统设计;
  • 高安全隔离:4kVrms隔离,满足安规要求,降低安全风险;
  • 小体积高密度:SIP封装,适合紧凑空间,提升设备集成度;
  • 低功耗节能:0.1W静态功耗,符合节能标准,降低长期运行成本;
  • 可靠保护:过流、短路保护,提升模块和负载的可靠性,减少维护次数。

综上,YLPTEC LS05-13B09R3是一款“性能均衡、适配性强、安全可靠”的小功率电源模块,适合对体积、输入范围、隔离安全有要求的各类场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.