WMSIC Electronic Components

YLPTEC TD302D232H Isolated RS-232 Transceiver TD302D232H

ModelTD302D232H
PackageDIP-11
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC TD302D232H
Type
YLPTEC
Minimum package
25 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
TD302D232H
Electronic Component
1
Package
DIP-11
Electronic Component
Other Module
Electronic Component
6.322g
Electronic Component
1
Features
Built-in Isolated DC / DCConverter
Electronic Component
BM0264335093
Operating Temperature
40℃~+85℃
Operating Voltage
3.15V~3.45V
Data
115.2Kbps
Static Current(Iq)
60mA
Electronic Component
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TD302D232H 产品概述

一 概述

TD302D232H(品牌:YLPTEC/易川)是一款高速双路隔离型RS-232收发器,专为工业级双向串行通信设计。器件集成隔离型DC/DC变换器,可用单电源供电同时实现控制器与RS-232线路间的电气隔离,最大隔离电压可达2500V(隔离等级满足常见工业环境的安全与抗干扰需求),无需外接隔离电源,降低系统复杂度与 BOM 成本。

二 主要规格

  • 数据速率:最高可达115.2 kbps(115200 bps)
  • 工作电压:3.15 V ~ 3.45 V(单电源供电)
  • 静态电流(Iq):60 mA
  • 隔离电压:2500 V(标称隔离能力)
  • 工作温度范围:-40 ℃ ~ +85 ℃(工业级)
  • 是否静电保护:是(具备 ESD 防护)
  • 功能特性:过压保护、内置隔离型 DC/DC 转换器
  • 封装:DIP-11(便于插板与原型调试)

三 主要特性与优势

  • 集成隔离型DC/DC:内部隔离电源消除了外部隔离电源设计,简化系统布局,节省空间与成本。
  • 双路收发功能:支持两个独立 RS-232 通道,适合同时驱动两路串口通信。
  • 工业级可靠性:宽温工作范围与较高隔离电压,适用于工业控制、数据采集等严苛环境。
  • 保护机制完善:内建过压保护与 ESD 抗扰能力,提高系统抗故障能力与长期可靠性。
  • DIP-11 封装:方便工程样机开发与维修替换。

四 典型应用

  • 工业自动化与 PLC 串口扩展
  • 远程数据采集(RTU)、现场总线网关
  • POS、售检票机、仪器仪表的人机通信接口
  • 医疗设备与测量设备中需要电气隔离的串口通信场合

五 设计与使用建议

  • 电源要求:严格提供 3.15–3.45 V 电源并做好滤波与稳压,避免超出额定范围。
  • 隔离区布局:在 PCB 布局时保持主次电路隔离走线与爬电距离,遵循厂家隔离设计建议以保证长期安全。
  • 去耦与滤波:尽量靠近芯片放置去耦电容和隔离变换器推荐的外部元件,以降低噪声与提高稳定性。
  • 信号完整性:在高波特率与长线缆应用中注意地线与接地方式,合理布线以减少干扰和反射。
  • 热管理:静态电流约 60 mA,评估系统功耗与散热环境,必要时采取散热措施。

六 封装与可靠性说明

DIP-11 封装便于手工焊接与快速原型验证,器件在工业温度范围内保持性能稳定。结合其过压与 ESD 保护功能,TD302D232H 是需要电气隔离且注重可靠性的串口设计的理想选择。若需进一步电气参数或应用电路,请参考 YLPTEC 提供的完整数据资料。

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